CHIP RESISTOR
标 准
Specifications
项目
测试方法
Item
Test Methods
片式电阻器
Resistor
跨接电阻
Jumper
无可见损伤
No mechanical damage
高温存储
High
Temperature
Exposure
(Storage)
无可见损伤
No mechanical damage
AEC-Q200 Test 3 /MIL-STD-202 Method 108
1000小时 @ T=155℃,不通电。
1000 hrs. @ T=155℃. Unpowered.
0.5%、1%:
F
级:0201
0402及以上
:
:
R
R
≤
≤
70 m
20 m
100 m
Ω
Ω
△
5%
R
:
≤±(1.0%R
+
+
0.05
0.05
Ω
)
)
J
级
:R≤
Ω
△R≤±(2.0%R
Ω
AEC-Q200 Test 4/JESD22 Method JA-104
预处理:2次回流焊。
Pretreatment:two times reflow soldering.
-55℃(30分钟)~常温(≤1分钟)~155℃(30分钟),1000个
循环。
-55℃(30min)~normal temperature(≤1min)~
155℃(30min),1000 cycles.
无可见损伤
No mechanical damage
无可见损伤
No mechanical damage
温度循环
Temperature
Cycling
0.5%、1%:
F级:0201
:
:
R
R
≤
≤
70 m
20 m
100 m
Ω
Ω
△
5%
R
:
≤±(0.5%R
+
0.05
0.05
Ω
)
)
0402及以上
J
级
:R≤
Ω
△R≤±(1.0%R
+
Ω
AEC-Q200 Test 7/ MIL-STD-202 Method 103
预处理:2次回流焊
Pretreatment:two times reflow soldering.
温度:85℃,湿度85%的条件下施加10%额定功率(电流)下的
电压值或元件极限电压(取最小值),放置1000小时,通1.5
小时/断0.5小时。
无可见损伤
No mechanical damage
级:0201 70 m
0402及以上 20 m
100 m
无可见损伤
No mechanical damage
△R≤±(3.0%R+0.05Ω)
高温高湿
Biased Humidity
F
:
:
≤
R
R
≤
≤
Ω
Ω
J级
:R
Ω
85
℃/85%RH,Apply 10% of operating power or limiting
element voltage for 1000 hours,1.5hour on, 0.5hour off.
AEC-Q200 Test 8/ MIL-STD-202 Method 108
预处理:2次回流焊
Pretreatment:two times reflow soldering.
125℃±2℃,1000小时,36% 额定功率(电流)下的电压值
或元件极限电压 (取较小值),通1.5小时/断0.5小时。
125℃±2℃,1000h,36% of rated power or limiting
无可见损伤
No mechanical damage
无可见损伤
No mechanical damage
工作寿命
Operational Life
F
级:0201
:
:
R
R
≤
≤
70 m
20 m
100 m
Ω
Ω
0.5% 1%:
、
0402及以上
△R≤±(1.0%R
+0.05
Ω
)
)
J级
:
R
≤
Ω
5%
:
△R≤±(3.0%R
+0.05Ω
element voltage whichever is lower for 1.5h ON/0.5h
OFF.
AEC-Q200 Test 12/ MIL-STD-202 Method 215
浸在三种溶剂3min后擦拭10次,浸、刷共3回来,用水洗清
洗剂进行清洗,并且室温下对整个表面进行通风干燥。
Immersed in three solvents after 3min immersion, brush
wipe 10 times, a total of 3 times, washing with washing
and cleaning agent, room temperature on the surface of
the ventilation drying.
耐溶剂性
Resistance to
Solvents
标志清晰,无可见损伤
Clearly marked,
No mechanical damage
AEC-Q200 Test 13/ MIL-STD-202 Method 213
正半弦波,峰值加速度:100g′s,脉冲持续时间:6ms,
三轴六向各3次,共18次。
Positive half wave, peak acceleration: 100g′s,
pulse duration: 6ms, three axis six to each 3 times,
a total of 18 times.
无可见损伤
No mechanical damage
级:0201 35 m
0402及以上 10 m
50 m
机械冲击
Mechanical
Shock
无可见损伤
No mechanical damage
≤±(1.0%R 0.05
F
:
:
≤
R
R
≤
≤
Ω
Ω
△R
+
Ω)
J级
:R
Ω
AEC-Q200 Test 14/ MIL-STD-202 Method 204
预处理:2次回流焊
Pretreatment:two times reflow soldering.
频率:10Hz~2000Hz,加速度:5 g′s,一个循环20min,
X、Y、Z 三个方向每个方向12个循环,共36个循环。
无可见损伤
No mechanical damage
级:0201 35 m
0402及以上 10 m
50 m
无可见损伤
No mechanical damage
≤±(1.0%R 0.05
振动
Vibration
F
:
:
≤
R
R
≤
≤
Ω
Ω
△
R
+
Ω)
Frequency: 10Hz ~ 2000Hz, acceleration: 5 g′s,
J级
:R
Ω
a loop 20min, X, Y, Z three directions, each direction
12 cycles, 36 cycles.
无可见损伤
No mechanical damage
0.5% 1%
无可见损伤
No mechanical damage
级:0201 35 m
0402及以上 10 m
50 m
AEC-Q200 Test 15/ MIL-STD-202 Method 210
270℃±5℃锡槽,保持10s±1s。
Lead-free solder bath at 270℃±5℃ for 10s±1s.
耐焊接热
Resistance to
Soldering Heat
、
:
F
:
:
≤
R
R
≤
≤
Ω
Ω
△R
≤±(0.5%R
+
0.05
Ω
)
5%
:
J级
:R
Ω
△R≤±(1.0%R
+
0.05
Ω
)
6