High Isolation SPDT Switch
DC to 15 GHz Die
ADH232S
1.0
SCOPE
This specification documents the detail requirements for space qualified die per MIL-PRF-38534 class K
except as modified herein.
The manufacturing flow described in the SPACE DIE BROCHURE is to be considered a part of this
specification.
This datasheet specifically details the space grade version of this product. A more detailed operational
description and a complete datasheet for commercial product grades can be found at
www.analog.com/HMC232
2.0
3.0
Part Number. The complete part number(s) of this specification follow:
Part Number
HMC8800
Description
DC-15GHz High Isolation SPDT Switch Die
Die Information
3.1
Die Dimensions
Bond Pad and Backside
Die Size
Die Thickness
Metalization
41 mil x 81 mil
4 mil ꢀ.ꢁ mil
Au
3.2 Die Picture
1. RF1*
2. A**
3. B**
4. RFC*
ꢁ. A**
6. B**
7. RF2*
8. A**
9. B**
1ꢀ. A**
Die bottom must be connected to RF
ground
Control Input
Signal Path State
No connection required for unlabeled pads
A
B
RFC to RF1
RFC to RF2
* (DC coupled, matched to ꢁꢀ ohms,
blocking cap required if RF line potential
not equal to ꢀV)
High
Low
Low
High
ON
OFF
OFF
ON
Caution: Do not“Hot Switch”power levels greater than +26 dBm (VCTL = ꢀ/-ꢁ VDC)
** Using any one of the A and any one of
the B Pads connection is acceptable
ASD0016558
Rev. D
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