ADF4217L/ADF4218L/ADF4219L
ABSOLUTE MAXIMUM RATINGS1, 2
TSSOP JA Thermal Impedance . . . . . . . . . . . . . 150.4°C/W
(
TA = 25°C, unless otherwise noted.)
LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112°C/W
JA
Lead Temperature, Soldering
VDD1 to GND3 . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +3.6 V
VDD1 to VDD2 . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
VP1, VP2 to GND . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.8 V
TSSOP, Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . 215°C
TSSOP, Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . 220°C
LGA, Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . 240°C
LGA, Infrared (20 sec) . . . . . . . . . . . . . . . . . . . . . . . 240°C
VP1, VP2 to VDD
1 . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V
Digital I/O Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V
Analog I/O Voltage to GND . . . . . . . . . –0.3 V to VP + 0.3 V
REFIN, RF1IN (A, B), IFIN (A, B)
to GND . . . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
RFINA to RFINB . . . . . . . . . . . . . . . . . . . . . . . . . . . 320 mV
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . 150°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operationalsections
of this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
2This device is a high performance RF integrated circuit with an ESD rating of
< 2 kV and is ESD sensitive. Proper precautions should be taken for handling and
assembly.
3GND = AGND = DGND = 0 V.
ORDERING GUIDE
Temperature
Range
Package
Description
Package
Option
Model
*
ADF4217L/ADF4218L/ADF4219LBRU
ADF4217L/ADF4218L/ADF4219LBCC
–40°C to +85°C
–40°C to +85°C
Thin Shrink Small Outline Package (TSSOP) RU-20
Chip Array CASON (LGA) CC-24
*Contact the factory for chip availability.
CAUTION
ESD(electrostaticdischarge)sensitivedevice.Electrostaticchargesashighas4000 Vreadilyaccumulate
on the human body and test equipment and can discharge without detection. Although the ADF4217L/
ADF4218L/ADF4219L feature proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
–4–
REV. C