Data Sheet
ADF4158
OUTLINE DIMENSIONS
DETAIL A
(JEDEC 95)
4.10
4.00 SQ
3.90
0.30
0.25
0.18
PIN 1
INDICATOR
PIN 1
24
19
INDIC ATOR AREA OPTIONS
0.50
BSC
ETAIL A)
(SEE D
18
1
EXPOSED
PAD
2.65
2.50 SQ
2.45
13
6
12
7
0.50
0.40
0.30
0.20 MIN
TOP VIEW
SIDE VIEW
BOTTOM VIEW
3.16 MIN
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.05 MAX
0.02 NOM
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD.
Figure 49. 24-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-24-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model1, 2
ADF4158CCPZ
ADF4158CCPZ-RL7
ADF4158WCCPZ
ADF4158WCCPZ-RL7
EVAL-ADF4158EB1Z
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
Package Option
CP-24-7
CP-24-7
CP-24-7
CP-24-7
24-Lead Lead Frame Chip Scale Package [LFCSP]
24-Lead Lead Frame Chip Scale Package [LFCSP]
24-Lead Lead Frame Chip Scale Package [LFCSP]
24-Lead Lead Frame Chip Scale Package [LFCSP]
Evaluation Board
1 Z = RoHS Compliant Part.
2 W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The ADF4158W models are available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
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D08728-0-6/18(I)
Rev. I | Page 35 of 35