Data Sheet
ADF4152HV
OUTLINE DIMENSIONS
5.10
5.00 SQ
4.90
0.30
0.25
0.18
PIN 1
INDICATOR
PIN 1
INDICATOR
25
24
32
1
0.50
BSC
3.65
3.50 SQ
3.45
EXPOSED
PAD
8
9
17
16
0.50
0.40
0.30
0.25 MIN
TOP VIEW
BOTTOM VIEW
3.50 REF
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.05 MAX
0.02 NOM
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
Figure 36. 32-Lead Lead Frame Chip Scale Package [LFCSP]
5 mm × 5 mm Body and 0.75 mm Package Height
(CP-32-11)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option
CP-32-11
CP-32-11
ADF4152HVBCPZ
ADF4152HVBCPZ-RL7
EVAL-ADF4152HVEB1Z
−40°C to +85°C
−40°C to +85°C
32-Lead Lead Frame Chip Scale Package [LFCSP]
32-Lead Lead Frame Chip Scale Package [LFCSP]
Evaluation Board
1 Z = RoHS Compliant Part.
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