Datasheet > ADC3561

ADC3561

更新时间： 2022-05-14 22:22:02

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德州仪器 - TI		/
页数	文件大小	规格书
74页	5014K
描述
ADC356x 16-Bit, 0.5-MSPS to 65-MSPS, Low-Noise, Low Power ADC

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ADC3561 数据手册

ADC3563

SBAS990 – FEBRUARY 2021

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

PARAMETER

TEST CONDITIONS

MIN

–0.3

MAX

2.1

UNIT

Supply voltage range, AVDD, IOVDD

Supply voltage range, GND, IOGND, REFGND

0.3

AINP/M, CLKP/M, DCLKINP/M, VREF, REFBUF

PDN/SYNC, RESET, SCLK, SEN, SDIO

2.1

Voltage applied to

input pins

2.1

Junction temperature, T_J

Storage temperature, T_stg

105

150

°C

–65

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾

2500

V_(ESD)

Electrostatic discharge

Charged device model (CDM), per JEDEC specification JESD22-C101,

all pins⁽²⁾

1000

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

1.75

–40

NOM

1.8

MAX UNIT

AVDD⁽¹⁾

1.85

Supply

voltage range

IOVDD⁽¹⁾

1.8

T_A

T_J

Operating free-air temperature

Operating junction temperature

105

°C

105⁽²⁾

(1) Measured to GND.

(2) Prolonged use above this junction temperature may increase the device failure-in-time (FIT) rate.

6.4 Thermal Information

ADC356x

RSB (QFN)

40 Pins

30.7

THERMAL METRIC⁽¹⁾

UNIT

R_ΘJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

°C/W

R_ΘJC(top)

R_ΘJB

16.4

10.5

Ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

0.2

Ψ_JB

10.5

R_ΘJC(bot)

2.0

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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