Datasheet > ADC3543

ADC3543

更新时间： 2023-09-03 20:27:37

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描述
单通道、14 位、65MSPS、低噪声、超低功耗和低延迟 ADC

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ADC3543 数据手册

ADC3541, ADC3542, ADC3543

ZHCSLJ1C –JULY 2020 –REVISED DECEMBER 2022

www.ti.com.cn

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

PARAMETER

TEST CONDITIONS

MIN

–0.3

MAX UNIT

Supply voltage range, AVDD, IOVDD

2.1

0.3

Supply voltage range, GND, IOGND, REFGND

AINP/M, CLKP/M, VREF, REFBUF

Voltage applied

to input pins

D3 (DCLKIN)

Junction temperature, T_J

MIN(2.1, AVDD+0.3)

MIN(2.1, IOVDD+0.3)

105

PDN, RESET, SCLK, SEN, SDIO

°C

Storage temperature, T_stg

150

–65

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings

VALUE

2500

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins⁽²⁾

V_(ESD)

Electrostatic discharge

1000

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

1.75

–40

NOM

1.8

MAX

1.85

UNIT

AVDD⁽¹⁾

Supply

voltage range

IOVDD⁽¹⁾

1.8

1.85

T_A

T_J

Operating free-air temperature

Operating junction temperature

105

°C

105⁽²⁾

(1) Measured to GND.

(2) Prolonged use above this junction temperature may increase the device failure-in-time (FIT) rate.

6.4 Thermal Information

ADC354x

THERMAL METRIC⁽¹⁾

RSB (QFN)

40 Pins

30.7

UNIT

R_ΘJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

°C/W

R_ΘJC(top)

R_ΘJB

16.4

10.5

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

0.2

Ψ_JT

10.5

Ψ_JB

R_ΘJC(bot)

2.0

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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