Datasheet > ADAU1860

ADAU1860

更新时间： 2023-12-20 18:45:42

品牌	Logo	应用领域
亚德诺 - ADI		编解码器
页数	文件大小	规格书
30页	2295K
描述
三个ADC、一个DAC、具有音频DSP的低功耗编解码器

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ADAU1860 数据手册

Data Sheet

ADAU1860/ADAU1860-1

OUTLINE DIMENSIONS

Figure 53. 56-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-56-6)

Dimensions shown in millimeters

Updated: March 11, 2023

ORDERING GUIDE

Package

Option

Model¹

Temperature Range

Package Description

Packing Quantity

ADAU1860BCBZRL²

-40°C to +85°C

56-Ball WLCSP (2.980 mm x 2.679 mm x 0.48

mm)

Reel, 5000

CB-56-6

ADAU1860-1BCBZRL³

-40°C to +85°C

56-Ball WLCSP (2.980 mm x 2.679 mm x 0.48

mm)

Reel, 5000

CB-56-6

Z = RoHS Compliant Part.

Available for ordering by customer based in the People’s Republic of China (PRC).

Available for ordering by customer based outside of PRC.

EVALUATION BOARDS

Model¹

Description

Evaluation Board

EVAL-ADAU1860EBZ

Z = RoHS Compliant Part.

I²C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).

registered trademarks are the property of their respective owners.

One Analog Way, Wilmington, MA 01887-2356, U.S.A.

Rev. B | 30 of 30

1...27 28 2930

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