Datasheet > ADA4320-1

ADA4320-1

更新时间： 2022-12-26 19:32:37

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
16页	365K
描述
High Power, Low Distortion Upstream

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ADA4320-1 数据手册

ADA4320-1

ABSOLUTE MAXIMUM RATINGS

Table 4.

MAXIMUM POWER DISSIPATION

Parameter

Rating

The maximum safe power dissipation in the ADA4320-1 package

is limited by the associated rise in junction temperature (T_J) on

the die. At approximately 150°C, which is the glass transition

temperature, the plastic changes its properties. Even temporarily

exceeding this temperature limit can change the stresses that

the package exerts on the die, permanently shifting the parametric

performance of the ADA4320-1. Exceeding a junction temperature

of 150°C for an extended time can result in changes in the silicon

devices, potentially causing failure.

Supply Voltage

5.5 V

1.65 W

−65°C to +125°C

−40°C to +85°C

300°C

Maximum Power Dissipation

Storage Temperature Range

Operating Temperature Range

Lead Temperature (Soldering, 10 sec)

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Airflow increases heat dissipation, effectively reducing θ_JA. In

addition, more metal directly in contact with the package leads

from metal traces, through-holes, ground, and power planes,

reduces the θ_JA. The exposed paddle on the underside of the

package must be soldered to a pad on the PCB surface that is

thermally connected to a copper plane to achieve the specified θ_JA.

THERMAL RESISTANCE

θ_JAis specified for the device soldered to a high thermal

conductivity 4-layer (2s2p) circuit board, as described in

EIA/JESD 51-7.

ESD CAUTION

Table 5. Thermal Resistance

Package Type

θ_JA

θ_JC

Unit

24-lead LFCSP

31.2

5.7

°C/W

Rev. 0 | Page 6 of 16

1...3 4 567 8 9...16

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