AD9559
Data Sheet
OUTLINE DIMENSIONS
0.60
0.42
0.24
10.00
BSC SQ
0.60
0.42
0.24
PIN 1
INDICATOR
55
54
72
1
PIN 1
INDICATOR
0.50
BSC
9.75
BSC SQ
7.10
BSC SQ
TOP VIEW
EXPOSEDPAD
(BOTTOM VIEW)
0.50
0.40
0.30
18
19
37
36
0.80 MAX
0.65 TYP
12° MAX
1.00
0.85
0.80
8.50 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.30
0.23
0.18
SEATING
PLANE
SECTION OF THIS DATA SHEET.
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-VNND-4
Figure 57. 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
10 mm × 10 mm Body, Very Thin Quad
(CP-72-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
F
Temperature Range
Package Description
Package Option
CP-72-4
CP-72-4
AD9559BCPZ
AD9559BCPZ-REEL7
AD9559/PCBZ
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Board
CP-72-4
1 Z = RoHS Compliant Part.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10644-0-7/12(0)
Rev. 0 | Page 120 of 120