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AD9517-1ABCPZ PDF预览

AD9517-1ABCPZ

更新时间: 2024-02-27 14:57:03
品牌 Logo 应用领域
亚德诺 - ADI 时钟驱动器时钟发生器逻辑集成电路PC
页数 文件大小 规格书
80页 2362K
描述
12-Output Clock Generator with Integrated 2.5 GHz VCO

AD9517-1ABCPZ 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:QFN
包装说明:HVQCCN,针数:48
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.73
系列:9517输入调节:DIFFERENTIAL MUX
JESD-30 代码:S-XQCC-N48JESD-609代码:e3
长度:7 mm逻辑集成电路类型:CLOCK DRIVER
湿度敏感等级:3功能数量:1
反相输出次数:端子数量:48
实输出次数:8最高工作温度:85 °C
最低工作温度:-40 °C输出特性:3-STATE
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):240传播延迟(tpd):2.6 ns
认证状态:Not QualifiedSame Edge Skew-Max(tskwd):0.675 ns
座面最大高度:1 mm最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:40宽度:7 mm
最小 fmax:2950 MHzBase Number Matches:1

AD9517-1ABCPZ 数据手册

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Data Sheet  
AD9517-1  
REVISION HISTORY  
3/13—Rev. D to Rev. E  
Change to CPRSET Pin Resistor Parameter..................................4  
Changes to Table 4 ............................................................................6  
Changes to VCP Supply Parameter.................................................14  
Changes to Table 19 ........................................................................16  
Added Exposed Paddle Notation to Figure 6; Changes to  
Changes to Table 52 ........................................................................57  
Changes to Table 57 ........................................................................70  
1/12—Rev. C to Rev. D  
Changes to Table 62 ........................................................................75  
Table 20.............................................................................................17  
Change to High Frequency Clock Distribution—CLK or  
5/11—Rev. B to Rev. C  
External VCO > 1600 MHz Section; Change to Table 22..........27  
Changes to Table 24 ........................................................................29  
Change to Configuration and Register Settings Section ...........31  
Change to Phase Frequency Detector (PFD) Section ................32  
Changes to Charge Pump (CP), On-Chip VCO, PLL  
External Loop Filter, and PLL Reference Inputs Sections .........33  
Change to Figure 46; Added Figure 47.........................................33  
Changes to Reference Switchover and VCXO/VCO  
Feedback Divider N—P, A, B, R Sections ....................................34  
Changes to Table 28 ........................................................................35  
Change to Holdover Section..........................................................37  
Changes to VCO Calibration Section...........................................39  
Changes to Clock Distribution Section........................................40  
Change to Clock Frequency Division Section;  
Changes to Features, Applications, and General Description  
Sections...............................................................................................1  
Change to CPRSET Pin Resistor Parameter, Table 1....................4  
Changes to Table 2 ............................................................................4  
Changes to Table 4 ............................................................................6  
Changes to Logic 1 Current and Logic 0 Current  
Parameters, Table 15 .......................................................................14  
Changes to Table 20 ........................................................................18  
Change to Caption, Figure 8..........................................................20  
Change to Caption, Figure 15........................................................21  
Change to Captions, Figure 25 and Figure 26 .............................23  
Added Figure 41; Renumbered Sequentially...............................25  
Changes to On-Chip VCO Section...............................................34  
Changes to Reference Switchover Section ...................................35  
Changes to Prescaler Section and Change to  
Change to Table 34..........................................................................41  
Changes to Channel Dividers—LVDS/CMOS Outputs  
Comments/Conditions Column, Table 28...................................36  
Changes to Automatic/Internal Holdover Mode Section  
Section; Change to Table 39...........................................................43  
Change to Write Section ................................................................50  
Change to MSB/LSB First Transfers .............................................51  
Change to Figure 64........................................................................52  
Added Thermal Performance Section..........................................54  
Changes to 0x003 Register Address..............................................55  
Changes to Table 53 ........................................................................58  
Changes to Table 54 ........................................................................59  
Changes to Table 55 ........................................................................65  
Changes to Table 56 ........................................................................67  
Changes to Table 57 ........................................................................69  
Changes to Table 58 ........................................................................71  
Changes to Table 59 ........................................................................72  
Changes to Table 60 and Table 61.................................................74  
Added Frequency Planning Using the AD9517 Section............75  
Changes to Figure 70 and Figure 72; Added Figure 71..............76  
Changes to LVDS Clock Distribution Section ............................76  
Added Exposed Paddle Notation to Outline Dimensions.........78  
Changes to Ordering Guide...........................................................78  
and Frequency Status Monitors Section.......................................39  
Changes to VCO Calibration Section...........................................40  
Changes to Clock Distribution Section........................................41  
Changes to Write Section...............................................................51  
Change to The Instruction Word (16 Bits) Section....................52  
Change to Figure 65........................................................................53  
Change to Thermal Performance Section....................................55  
Changes to Register Address 0x01C, Bits[4:3], Table 52............56  
Changes to Address 0x017, Bits[1:0] and Address 0x018,  
Bits[2:0], Table 54............................................................................62  
Changes to Register Address 0x01C, Bits[5:1], Table 54............64  
Change to LVPECL Clock Distribution Section.........................77  
5/10—Rev. A to Rev. B  
Changes to Default Values of LVDS/CMOS Outputs  
Section in Table 52 ..........................................................................56  
Changes to Register 0x140, Bit 0; Register 0x142, Bit 0;  
Register 0x143, Bit 0 in Table 57 ...................................................69  
Updated Outline Dimensions, Changes to Ordering Guide.....78  
7/07—Revision 0: Initial Version  
1/10—Rev. 0 to Rev. A  
Added 48-Lead LFCSP Package (CP-48-8) .................... Universal  
Changes to Features, Applications, and General Description.....1  
Rev. E | Page 3 of 80  
 

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