AD9432
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Table 2.
Table 3 lists AD9432 thermal characteristics for simulated typical
performance in a 4-layer JEDEC board, horizontal orientation.
Parameter
Rating
VDD
6 V
VCC
6 V
Table 3. Thermal Resistance
Package Type
Analog Inputs
Digital Inputs
VREFIN
Digital Output Current
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Maximum Case Temperature
−0.5 V to VCC + 0.5 V
−0.5 V to VDD + 0.5 V
−0.5 V to VCC + 0.5 V
20 mA
−55°C to +125°C
−65°C to +150°C
150°C
θJA
50
θJMA
θJC
Unit
52-Lead LQFP (ST-52)
No Airflow
52-Lead TQFP_EP (SV-52-2)1
No Airflow
1.0 m/s Airflow
°C/W
°C/W
°C/W
°C/W
2
19.3
16
150°C
1 Bottom of package (soldered exposed pad).
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
EXPLANATION OF TEST LEVELS
I
100% production tested.
II 100% production tested at 25°C and sample tested at
specified temperatures.
III Sample tested only.
IV Parameter is guaranteed by design and characterization
testing.
V
Parameter is a typical value only.
VI 100% production tested at 25°C; guaranteed by design and
characterization testing for industrial temperature range.
Rev. F | Page 6 of 16