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AD8390ACP-REEL PDF预览

AD8390ACP-REEL

更新时间： 2024-01-23 02:37:48
品牌 Logo 应用领域
亚德诺 - ADI 放大器
页数 文件大小 规格书
16页 674K
描述
Low Power, High Output Current Differential Amplifier

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AD8390ACP-REEL 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：SSOP
包装说明：HSSOP,针数：16
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.33.00.01风险等级：5.68
放大器类型：OPERATIONAL AMPLIFIER最大平均偏置电流 (IIB)：7 µA
标称共模抑制比：64 dB最大输入失调电压：3000 µV
JESD-30 代码：R-PDSO-G16JESD-609代码：e3
长度：4.9 mm湿度敏感等级：3
负供电电压上限：-13.2 V标称负供电电压 (Vsup)：-5 V
功能数量：1端子数量：16
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：HSSOP
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
峰值回流温度（摄氏度）：260认证状态：Not Qualified
座面最大高度：1.75 mm标称压摆率：300 V/us
子类别：Operational Amplifier供电电压上限：13.2 V
标称供电电压 (Vsup)：5 V表面贴装：YES
温度等级：INDUSTRIAL端子面层：Matte Tin (Sn)
端子形式：GULL WING端子节距：0.635 mm
端子位置：DUAL处于峰值回流温度下的最长时间：40
宽度：3.9 mmBase Number Matches：1

AD8390ACP-REEL 数据手册

 浏览型号AD8390ACP-REEL的Datasheet PDF文件第9页浏览型号AD8390ACP-REEL的Datasheet PDF文件第10页浏览型号AD8390ACP-REEL的Datasheet PDF文件第11页浏览型号AD8390ACP-REEL的Datasheet PDF文件第13页浏览型号AD8390ACP-REEL的Datasheet PDF文件第14页浏览型号AD8390ACP-REEL的Datasheet PDF文件第15页 
AD8390  
To obtain optimum thermal performance from the AD8390 in  
either package, it is essential that the thermal pad be soldered to  
a ground plane with minimal thermal resistance. This is par-  
ticularly true for dense circuit designs with multiple integrated  
circuits. Furthermore, the PCB should be designed in such a  
manner as to draw the heat away from the ICs. Figure 26  
illustrates the relationship between thermal resistance (°C/W)  
and the copper area (mm2) for the AD8390ACP soldered down  
to a 4-layer board with a given copper area.  
LAYOUT, GROUNDING, AND BYPASSING  
The first layout requirement is for a good solid ground plane  
that covers as much of the board area around the AD8390 as  
possible. The only exception to this is that the two input pins  
should be kept a few millimeters from the ground plane, and  
ground should be removed from inner layers and the opposite  
side of the board under the input traces. This minimizes the  
stray capacitance on these nodes and helps preserve the gain  
flatness versus frequency.  
Figure 26 can be used to help determine the copper board area  
required for proper thermal management of the AD8390. The  
power dissipation of the AD8390 can be computed using  
Equation 11. This number can then be inserted into the  
following equation to yield the required θJA:  
The power supply pins should be bypassed as close as possible  
to the device on a ground plane common with signal ground.  
Good high frequency, ceramic chip capacitors should be used.  
This bypassing should be done with a capacitance value of  
0.01 μF to 0.1 μF for each supply. Low frequency bypassing  
should be provided with 10 μF tantalum capacitors from each  
supply to signal ground. The signal routing should be short and  
direct to avoid parasitic effects, particularly on traces connected  
to the amplifier inputs. Wherever there are complementary  
signals, a symmetrical layout should be provided to the extent  
possible to maximize the balance performance. When running  
differential signals over a long distance, the traces on the PCB  
should be close together.  
TRISE  
PAD8390  
°C  
W
θJA  
=
=
(12)  
where TRISE is the delta from the maximum expected ambient  
temperature to the highest allowable die temperature. It is  
generally recommended that the maximum die temperature be  
limited to 125°C, and in no case should it be allowed to exceed  
150°C.  
POWER DISSIPATION AND THERMAL  
MANAGEMENT  
Using the θJA computed in Equation 12, Figure 26 can be used to  
determine the minimum copper area required for proper thermal  
dissipation of the AD8390.  
The AD8390 was designed to be the most efficient class AB  
ADSL/ADSL2+ line driver available. Figure 11 shows the total  
power consumption (delivered line power and power consumed)  
of the AD8390 driving ADSL signals at varying output powers  
and power modes. To accurately determine the amount of  
power dissipated by the AD8390, it is necessary to subtract the  
power delivered to the load, matching losses, and transformer  
losses as follows:  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
PAD8390 = Psupply,mW − Pload,mW − Plosses,mW  
(11)  
where:  
P
P
P
supply,mW is the total supply power in mW drawn by the AD8390.  
load,mW is the power delivered into a 100 Ω twisted-pair line in mW.  
losses,mW is the power dissipated by the matching resistors and  
1
10  
100  
Cu AREA (mm  
1000  
10000  
2)  
the transformer in mW.  
Figure 26. Thermal Resistance vs. Copper Area  
While this discussion focuses mainly on ADSL applications, the  
same premise can be applied to determining the power dissipa-  
tion of the AD8390 in any application.  
Rev. C | Page 12 of 16  
 
 
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