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AD8387-EB

更新时间： 2024-02-22 09:26:05

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
16页	398K
描述
High Performance, 12-Bit, 12-Channel Decimating, LCD DecDriver

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AD8387-EB 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	QFP
包装说明：	HTFQFP,	针数：	80
Reach Compliance Code：	unknown	风险等级：	5.68
Is Samacsys：	N	接口集成电路类型：	INTERFACE CIRCUIT
JESD-30 代码：	S-PQFP-G80	JESD-609代码：	e3
长度：	12 mm	湿度敏感等级：	3
功能数量：	1	端子数量：	80
最高工作温度：	85 °C	最低工作温度：
封装主体材料：	PLASTIC/EPOXY	封装代码：	HTFQFP
封装形状：	SQUARE	封装形式：	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）：	260	认证状态：	COMMERCIAL
座面最大高度：	1.2 mm	最大供电电压：	3.6 V
最小供电电压：	3 V	标称供电电压：	3.3 V
表面贴装：	YES	技术：	BIPOLAR
温度等级：	OTHER	端子面层：	MATTE TIN
端子形式：	GULL WING	端子节距：	0.5 mm
端子位置：	QUAD	处于峰值回流温度下的最长时间：	40
宽度：	12 mm	Base Number Matches：	1

AD8387-EB 数据手册

AD8387

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

When TSW is HIGH, the output current limiter, as well as the

thermal switch, is enabled. The thermal switch debiases the

output amplifier when the junction temperature reaches the

internally set trip point. In the event of an extended short-

circuit between a video output and a power supply rail, the

output amplifier current continues to switch between 0 and

100 mA typical with a period determined by the thermal time

constant and the hysteresis of the thermal trip point. The

thermal switch, when enabled, provides long-term protection

from accidental shorts during the assembly process by limiting

the average junction temperature to a safe level.

Rating

Supply Voltages

AVCCx − AGNDx

DVCC − DGND

Input Voltages

Maximum Digital Input Voltage

Minimum Digital Input Voltage

Maximum Analog Input Voltage

Minimum Analog Input Voltage

Internal Power Dissipation¹

TQFP E-Pad @ T_A= 25°C

Operating Temperature Range

Storage Temperature Range

Lead Temperature Range (Soldering 10 sec)

18 V

4.5 V

DVCC + 0.5 V

DGND − 0.5 V

AVCC + 0.5 V

AGND − 0.5 V

4.38 W

MAXIMUM POWER DISSIPATION

0°C to 85°C

−65°C to +125°C

300°C

The maximum power that the AD8387 can safely dissipate is

limited by its junction temperature. The maximum safe junction

temperature for plastic encapsulated devices, as determined by the

glass transition temperature of the plastic, is approximately 150°C.

Exceeding this limit temporarily can cause a shift in the parametric

performance due to a change in the stresses exerted on the die by

the package. Exceeding a junction temperature of 150°C for an

extended period can result in device failure.

¹80-lead TQFP E-Pad:

θ_JA= 28.5°C/W (still air) [JEDEC Standard, 4-layer PCB in still air]

θ_JC= 12.2°C/W

_JB= 14.6°C/W

Ψ_JB= 12.0°C/W

Ψ_JT= 0.3°C/W.

Stresses above those listed under the Absolute Maximum

Ratings may cause permanent damage to the device. This is a

stress rating only; functional operation of the device at these or

any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to the

absolute maximum ratings for extended periods may reduce

device reliability.

OPERATING TEMPERATURE RANGE

To ensure operation within the specified operating temperature

range, it is necessary to limit the maximum power dissipation as

follows.

3.0

EXPOSED PADDLE

500LFM

200LFM

2.5

To ensure optimized thermal performance, the exposed paddle

must be thermally connected to an external plane, such as

AVCC or GND, as described in the Applications section.

STILL AIR

2.0

OVERLOAD PROTECTION

The AD8387 overload protection circuit consists of an output

current limiter and a thermal switch.

1.5

QUIESCENT

When TSW is LOW, the thermal switch is disabled and the

output current limiter is enabled. The maximum current at any

one output is internally limited to 100 mA average. In the event

of a momentary short-circuit between a video output and a

power supply rail (VCC or AGND), the output current limit is

sufficiently low to provide temporary protection.

THERMAL

SWITCH

1.0

ENABLED

100

DISABLED

100 105 110 115 120 125

AMBIENT TEMPERATURE (°C)

Figure 3. Maximum Power Dissipation vs. Temperature,

AD8387 on a 4-Layer JEDEC PCB with Thermally Optimized Landing

Pattern as Described in the Applications Section

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.

Rev. 0 | Page 5 of 16

1 2 3 456 7 8...16

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