AD8315
4
4
3
–30°C
+85°C
3
2
2
1
1
0
0
–1
–2
–3
–1
–2
–3
–4
+85°C
–30°C
ERROR AT +85°C AND –30°C
BASED ON DEVIATION FROM
SLOPE AND INTERCEPT AT +25°C
ERROR AT +85°C AND –30°C
BASED ON DEVIATION FROM
SLOPE AND INTERCEPT AT +25°C
–4
–80
–70
–60
–50
RF INPUT AMPLITUDE (dBV)
(–47dBm)
–40
–30
–20
–10
0
–80
–70
–60
RF INPUT AMPLITUDE (dBV)
(–47dBm)
–50
–40
–30
–20
–10
0
(+3dBm)
(+3dBm)
Figure 9. Distribution of Error at Temperature After Ambient Normalization vs.
Input Amplitude, 3 Sigma to Either Side of Mean, 0.1 GHz
Figure 12. Distribution of Error at Temperature After Ambient Normalization vs.
Input Amplitude, 3 Sigma to Either Side of Mean, 1.9 GHz
4
4
3
3
–30°C
2
1
2
1
0
0
–1
–1
+85°C
–30°C
–2
–2
+85°C
ERROR AT +85°C AND –30°C
–3
ERROR AT +85°C AND –30°C
BASED ON DEVIATION FROM
SLOPE AND INTERCEPT AT +25°C
–3
BASED ON DEVIATION FROM
SLOPE AND INTERCEPT AT +25°C
–4
–4
–80
–70
–60
RF INPUT AMPLITUDE (dBV)
(–47dBm)
–50
–40
–30
–20
–10
0
–80
–70
–60
–50
RF INPUT AMPLITUDE (dBV)
(–47dBm)
–40
–30
–20
–10
0
(+3dBm)
(+3dBm)
Figure 10. Distribution of Error at Temperature After Ambient Normalization vs.
Input Amplitude, 3 Sigma to Either Side of Mean, 0.9 GHz
Figure 13. Distribution of Error at Temperature After Ambient Normalization vs.
Input Amplitude, 3 Sigma to Either Side of Mean, 2.5 GHz
0
3000
2700
2400
2100
1800
1500
1200
900
600
300
0
10
–200
–400
–600
–800
–1000
–1200
–1400
–1600
–1800
–2000
8
CHIP SCALE (LFCSP)
FREQUENCY MSOP
(GHz)
0.1
0.9
1.9
R
– jXΩ
R – jXΩ
2900 – j1900
700 – j240
130 – j80
2700 – j1500
730 – j220
460 – j130
440 – j110
6
4
X (LFCSP)
170 – j70
2.5
R
X
DECREASING
INCREASING
X (MSOP)
V
V
ENBL
ENBL
R (LFCSP)
2
0
R (MSOP)
1.3
1.4
1.5
1.6
1.7
0
0.5
1.0
1.5
2.0
2.5
V
(V)
FREQUENCY (GHz)
ENBL
Figure 11. Input Impedance
Figure 14. Supply Current vs. VENBL
Rev. C | Page 8 of 24