AD8233
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 3.
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Parameter
Rating
Supply Voltage
3.6 V
Output Short-Circuit Current Duration
Maximum Voltage, Any Terminal1
Minimum Voltage, Any Terminal1
Storage Temperature Range
Operating Temperature Range
Maximum Junction Temperature
ESD Rating
Indefinite
+VS + 0.3 V
−0.3 V
−65°C to +125°C
−40°C to +85°C
140°C
Table 4. Thermal Resistance
θJA (°C/W)
Package
Type
θJC
PCB
Power (W) 0 ms
1 ms 2 ms (°C/W)
CP-20-13
1S0P1
0.25
1.25
0.25
1.25
108.5
101.1
47.9
89.0
87.3
43.4
43.3
82.3
87.3
42.1
42.1
0.6
0.6
0.7
0.7
2S2P2
HBM
8 kV
1 kV
46.8
Charged Device Model (FICDM)
1 Simulated thermal numbers per JESD51-9: 1-layer PCB (1S0P), low effective
thermal conductivity test board.
1 This level or the maximum specified supply voltage, whichever is the lesser,
indicates the superior voltage limit for any terminal. If input voltages beyond
the specified minimum or maximum voltages are expected, place resistors in
series with the inputs to limit the current to less than 5 mA.
2 4-layer PCB (2S2P), high effective thermal conductivity test board.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
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