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AD8231ACPZ-R7

更新时间： 2024-01-12 10:46:29
品牌 Logo 应用领域
亚德诺 - ADI 仪表放大器放大器电路
页数 文件大小 规格书
20页 621K
描述
Zero Drift, Digitally Programmable Instrumentation Amplifier

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AD8231ACPZ-R7 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Active零件包装代码：QFN
包装说明：HVQCCN,针数：16
Reach Compliance Code：unknown风险等级：5.76
Is Samacsys：N放大器类型：INSTRUMENTATION AMPLIFIER
最大平均偏置电流 (IIB)：0.005 µA标称带宽 (3dB)：1 MHz
最小共模抑制比：100 dB最大输入失调电流 (IIO)：0.0005 µA
最大输入失调电压：15 µVJESD-30 代码：S-XQCC-N16
JESD-609代码：e3长度：4 mm
湿度敏感等级：3最大非线性：0.005%
功能数量：1端子数量：16
最高工作温度：125 °C最低工作温度：-40 °C
封装主体材料：UNSPECIFIED封装代码：HVQCCN
封装形状：SQUARE封装形式：CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）：260认证状态：COMMERCIAL
座面最大高度：1 mm标称压摆率：1.1 V/us
子类别：Instrumentation Amplifier供电电压上限：6 V
标称供电电压 (Vsup)：5 V表面贴装：YES
温度等级：AUTOMOTIVE端子面层：MATTE TIN
端子形式：NO LEAD端子节距：0.65 mm
端子位置：QUAD处于峰值回流温度下的最长时间：40
宽度：4 mmBase Number Matches：1

AD8231ACPZ-R7 数据手册

 浏览型号AD8231ACPZ-R7的Datasheet PDF文件第12页浏览型号AD8231ACPZ-R7的Datasheet PDF文件第13页浏览型号AD8231ACPZ-R7的Datasheet PDF文件第14页浏览型号AD8231ACPZ-R7的Datasheet PDF文件第16页浏览型号AD8231ACPZ-R7的Datasheet PDF文件第17页浏览型号AD8231ACPZ-R7的Datasheet PDF文件第18页 
AD8231  
INCORRECT  
CORRECT  
INPUT BIAS CURRENT RETURN PATH  
The input bias current of the AD8231 must have a return path  
to common. When the source, such as a thermocouple, cannot  
provide a return current path, one should be created, as shown  
in Figure 32.  
AD8231  
AD8231  
IN-AMP  
IN-AMP  
V
REF  
V
REF  
INCORRECT  
CORRECT  
+
+V  
+V  
S
S
AD8231  
OP AMP  
–
Figure 31. Driving the Reference Pin  
AD8231  
AD8231  
REF  
REF  
REF  
REF  
LAYOUT  
The AD8231 is a high precision device. To ensure optimum  
performance at the PC board level, care must be taken in the  
design of the board layout. The AD8231 pinout is arranged in  
a logical manner to aid in this task.  
–V  
S
–V  
S
TRANSFORMER  
TRANSFORMER  
+V  
+V  
S
S
Power Supplies  
The AD8231 should be decoupled with a 0.1 μF bypass capacitor  
between the two supplies. This capacitor should be placed as close  
as possible to Pin 11 and Pin 12, either directly next to the pins or  
beneath the pins on the backside of the board. The AD8231’s auto-  
zero architecture requires a low ac impedance between the supplies.  
Long trace lengths to the bypass capacitor increase this impedance,  
which results in a larger input offset voltage.  
AD8231  
AD8231  
REF  
10MΩ  
–V  
–V  
S
S
THERMOCOUPLE  
THERMOCOUPLE  
A stable dc voltage should be used to power the instrumentation  
amplifier. Noise on the supply pins can adversely affect  
performance.  
+V  
+V  
S
S
C
C
C
R
R
Package Considerations  
1
fHIGH-PASS  
=
AD8231  
2πRC  
AD8231  
C
The AD8231 comes in a 4 mm × 4 mm LFCSP. Beware of  
blindly copying the footprint from another 4 mm × 4 mm  
LFCSP part; it may not have the same thermal pad size and  
leads. Refer to the Outline Dimensions section to verify that the  
PCB symbol has the correct dimensions. Space between the  
leads and thermal pad should be kept as wide as possible for the  
best bias current performance.  
REF  
–V  
–V  
S
S
CAPACITIVELY COUPLED  
CAPACITIVELY COUPLED  
Figure 32. Creating an IBIAS Path  
RF INTERFERENCE  
Thermal Pad  
RF rectification is often a problem when amplifiers are used in  
applications where there are strong RF signals. The disturbance  
can appear as a small dc offset voltage. High frequency signals  
can be filtered with a low-pass, RC network placed at the input  
of the instrumentation amplifier, as shown in Figure 33. The  
filter limits the input signal bandwidth according to the  
following relationship:  
The AD8231 4 mm × 4 mm LFCSP comes with a thermal pad.  
This pad is connected internally to −VS. The pad can either be  
left unconnected or connected to the negative supply rail. For  
high vibration applications, a landing is recommended.  
Because the AD8231 dissipates little power, heat dissipation is  
rarely an issue. If improved heat dissipation is desired (for  
example, when ambient temperatures are near 125°C or when  
driving heavy loads), connect the thermal pad to the negative  
supply rail. For the best heat dissipation performance, the  
negative supply rail should be a plane in the board. See the  
Thermal Resistance section for thermal coefficients with and  
without the pad soldered.  
1
FilterFreqDiff =  
2π R(2CD + CC )  
1
FilterFreqCM =  
2π RCC  
where CD ≥ 10CC.  
Rev. 0 | Page 15 of 20  
 
 
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