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AD8137

更新时间： 2024-01-18 14:34:11
品牌 Logo 应用领域
爱美达 - AAVID 驱动器
页数 文件大小 规格书
32页 588K
描述
Low Cost, Low Power, Differential ADC Driver

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中文翻译

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AD8137 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：SOIC
包装说明：SOP,针数：8
Reach Compliance Code：unknown风险等级：5.28
放大器类型：OPERATIONAL AMPLIFIER最大平均偏置电流 (IIB)：1 µA
标称共模抑制比：79 dB最大输入失调电压：2600 µV
JESD-30 代码：R-PDSO-G8JESD-609代码：e3
长度：4.9 mm湿度敏感等级：1
负供电电压上限：-6 V标称负供电电压 (Vsup)：-5 V
功能数量：1端子数量：8
最高工作温度：125 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：SOP
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：260座面最大高度：1.75 mm
标称压摆率：450 V/us子类别：Operational Amplifier
供电电压上限：6 V标称供电电压 (Vsup)：5 V
表面贴装：YES温度等级：AUTOMOTIVE
端子面层：MATTE TIN端子形式：GULL WING
端子节距：1.27 mm端子位置：DUAL
处于峰值回流温度下的最长时间：40宽度：3.9 mm

AD8137 数据手册

 浏览型号AD8137的Datasheet PDF文件第6页浏览型号AD8137的Datasheet PDF文件第7页浏览型号AD8137的Datasheet PDF文件第8页浏览型号AD8137的Datasheet PDF文件第10页浏览型号AD8137的Datasheet PDF文件第11页浏览型号AD8137的Datasheet PDF文件第12页 
Data Sheet  
AD8137  
ABSOLUTE MAXIMUM RATINGS  
Table 4.  
The power dissipated in the package (PD) is the sum of the  
quiescent power dissipation and the power dissipated in the  
package due to the load drive for all outputs. The quiescent  
power is the voltage between the supply pins (VS) times the  
quiescent current (IS). The load current consists of differential  
and common-mode currents flowing to the load, as well as  
currents flowing through the external feedback networks and  
the internal common-mode feedback loop. The internal resistor  
tap used in the common-mode feedback loop places a 1 kΩ  
differential load on the output. RMS output voltages should be  
considered when dealing with ac signals.  
Parameter  
Rating  
Supply Voltage  
VOCM  
Power Dissipation  
Input Common-Mode Voltage  
Storage Temperature Range  
Operating Temperature Range  
Lead Temperature (Soldering, 10 sec)  
Junction Temperature  
12 V  
VS+ to VS−  
See Figure 3  
VS+ to VS−  
−65°C to +125°C  
−40°C to +125°C  
300°C  
150°C  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Airflow reduces θJA. In addition, more metal directly in contact  
with the package leads from metal traces, through holes, ground,  
and power planes reduces the θJA.  
Figure 3 shows the maximum safe power dissipation in the  
package vs. the ambient temperature for the 8-lead SOIC  
(125°C/W) and 8-lead LFCSP (θJA = 70°C/W) on a JEDEC  
standard 4-layer board. θJA values are approximations.  
THERMAL RESISTANCE  
3.0  
θJA is specified for the worst-case conditions, that is, θJA is  
specified for the device soldered in a circuit board in still air.  
2.5  
LFCSP  
Table 5. Thermal Resistance  
2.0  
Package Type  
θJA  
157  
125  
70  
θJC  
56  
56  
56  
Unit  
°C/W  
°C/W  
°C/W  
8-Lead SOIC/2-Layer  
8-Lead SOIC/4-Layer  
8-Lead LFCSP/4-Layer  
1.5  
1.0  
SOIC-8  
0.5  
0
MAXIMUM POWER DISSIPATION  
The maximum safe power dissipation in the AD8137 package  
is limited by the associated rise in junction temperature (TJ) on  
the die. At approximately 150°C, which is the glass transition  
temperature, the plastic changes its properties. Even temporarily  
exceeding this temperature limit may change the stresses that  
the package exerts on the die, permanently shifting the parametric  
performance of the AD8137. Exceeding a junction temperature  
of 175°C for an extended period can result in changes in the  
silicon devices, potentially causing failure.  
–40–30–20–10  
0
10 20 30 40 50 60 70 80 90 100 110120  
AMBIENT TEMPERATURE (°C)  
Figure 3. Maximum Power Dissipation vs.  
Ambient Temperature for a 4-Layer Board  
ESD CAUTION  
Rev. E | Page 9 of 32  
 
 
 
 
 
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