AD7834/AD7835
ABSOLUTE MAXIMUM RATINGS1
(TA = +25°C unless otherwise noted)
VCC to DGND . . . . . . . . . . . . . . . –0.3 V, +7 V or VDD + 0.3 V
(Whichever Is Lower)
SOIC Package
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . +75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
PQFP Package
V
V
DD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +17 V
SS to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –17 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +0.3 V
Digital Inputs to DGND . . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V
V
V
V
REF(+) to VREF(–) . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +18 V
REF(+) to AGND . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
REF(–) to AGND . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 95°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
PLCC Package
DSG to AGND . . . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
OUT (1–4) to AGND . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
V
Operating Temperature Range
θJA Thermal Impedance. . . . . . . . . . . . . . . . . . . . . . +55°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
Power Dissipation (Any Package) . . . . . . . . . . . . . . . . 480 mW
Industrial (A Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Extended (S Version). . . . . . . . . . . . . . . . . –55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic Package
NOTES
1Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2Transient currents of up to 100 mA will not cause SCR latch up.
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . +75°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C
Cerdip Package
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . +52°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300°C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7834/AD7835 feature proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE
Linearity
Temperature
Range
Error
(LSBs)
DNL
(LSBs)
Package
Model
Option1
AD7834AR
AD7834BR
AD7834AN
AD7834BN
AD7834SQ
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–55°C to +125°C
±2
±1
±2
±1
±2
±0.9
±0.9
±0.9
±0.9
±0.9
R-28
R-28
N-28
N-28
Q-28
AD7835AS2
AD7835BS2
AD7835AP2
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
±2
±1
±2
±0.9
±0.9
±0.9
S-44
S-44
P-44A
NOTES
1R = Small Outline IC (SOIC); N = Plastic DIP; Q = Cerdip; S = Plastic Quad Flatpack (PQFP);
P = Plastic Leaded Chip Carrier (PLCC).
2Contact Sales Office for availability.
–4–
REV. A
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