Datasheet > AD7741YR-REEL7

AD7741YR-REEL7

更新时间： 2024-01-30 02:53:57

品牌	Logo	应用领域
亚德诺 - ADI		光电二极管转换器
页数	文件大小	规格书
12页	148K
描述
VOLTAGE-FREQUENCY CONVERTER, 6.144MHz, PDSO8, 0.150 INCH, SOIC-8

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AD7741YR-REEL7 技术参数

Source Url Status Check Date：	2013-05-01 14:56:20.251	是否无铅：	含铅
是否Rohs认证：	不符合	生命周期：	Obsolete
零件包装代码：	SOIC	包装说明：	SOP, SOP8,.25
针数：	8	Reach Compliance Code：	not_compliant
ECCN代码：	EAR99	HTS代码：	8542.39.00.01
风险等级：	5.34	转换器类型：	VOLTAGE TO FREQUENCY CONVERTER
JESD-30 代码：	R-PDSO-G8	JESD-609代码：	e0
长度：	4.9 mm	最大线性误差 (EL)：	0.024%
湿度敏感等级：	1	功能数量：	1
端子数量：	8	最大工作频率：	6.144 MHz
最高工作温度：	105 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	SOP
封装等效代码：	SOP8,.25	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE	峰值回流温度（摄氏度）：	240
最大正输入电压：	2.5 V	电源：	5 V
认证状态：	Not Qualified	座面最大高度：	2.59 mm
子类别：	Analog Special Function Converters	最大压摆率：	8 mA
最大供电电压：	5.25 V	最小供电电压：	4.75 V
标称供电电压：	5 V	表面贴装：	YES
技术：	CMOS	温度等级：	INDUSTRIAL
端子面层：	Tin/Lead (Sn85Pb15)	端子形式：	GULL WING
端子节距：	1.27 mm	端子位置：	DUAL
处于峰值回流温度下的最长时间：	30	宽度：	3.9 mm
Base Number Matches：	1

AD7741YR-REEL7 数据手册

AD7741/AD7742

Power Supply Bypassing and Grounding

Isolation Applications

In any circuit where accuracy is important, careful consideration

of the power supply and ground return layout helps to ensure

the rated performance. The printed circuit board housing the

AD7741/AD7742 should be designed so the analog and digital

sections are separated and confined to certain areas of the board.

In addition to analog-to-digital conversion, the AD7741/AD7742

can be used in isolated analog signal transmission applications.

Due to noise, safety requirements or distance, it may be neces-

sary to isolate the AD7741/AD7742 from any controlling

circuitry. This can easily be achieved by using opto-isolators,

which will provide isolation in excess of 3 kV.

To minimize capacitive coupling between them, digital and

analog ground planes should only be joined in one place, close

to the DUT and should not overlap.

Opto-electronic coupling is a popular method of isolated signal

coupling. In this type of device, the signal is coupled from an

input LED to an output photo-transistor, with light as the con-

necting medium. This technique allows dc to be transmitted, is

extremely useful in overcoming ground loops between equip-

ment, and is applicable over a wide range of speeds and power.

Avoid running digital lines under the device as these will couple

noise onto the die. The analog ground plane should be allowed

to run under the AD7742 to avoid noise coupling. The power

supply lines to the AD7742 should use as large a trace as pos-

sible to provide low impedance paths and reduce the effects of

glitches on the power supply line. Fast switching signals like

clocks should be shielded with digital ground to avoid radiating

noise to other parts of the board and clock signals should never

be run near analog inputs. Avoid crossover of digital and analog

signals. Traces on opposite sides of the board should run at

right angles to each other. This reduces the effect of feedthrough

through the board. A microstrip technique is by far the best but

is not always possible with a double-sided board. In this tech-

nique, the component side of the board is dedicated to the ground

plane while the signal traces are placed on the solder side.

The analog voltage to be transmitted is converted to a pulse

train using the VFC. An opto-isolator circuit is used to couple

this pulse train across an isolation barrier using light as the

connecting medium. The input LED of the isolator is driven

from the output of the AD7741/AD7742. At the receiver side,

the output transistor is operated in the photo-transistor mode.

The pulse train can be reconverted to an analog voltage using a

frequency-to-voltage converter; alternatively, the pulse train can

be fed into a counter to generate a digital signal.

The analog and digital sections of the AD7741/AD7742 have

been designed to allow operation from a single-ended power

source, simplifying its use with isolated power supplies.

Good decoupling is also important. All analog supplies should

be decoupled to GND with surface mount capacitors, 10 µF in

parallel with 0.1 µF located as close to the package as possible,

ideally right up against the device. The lead lengths on the by-

pass capacitor should be as short as possible. It is essential that

these capacitors be placed physically close to the AD7741/AD7742

to minimize the inductance of the PCB trace between the ca-

pacitor and the supply pin. The 10 µF are the tantalum bead

type and are located in the vicinity of the VFC to reduce low-

frequency ripple. The 0.1 µF capacitors should have low Effec-

tive Series Resistance (ESR) and Effective Series Inductance

(ESI), such as the common ceramic types, which provide a low

impedance path to ground at high frequencies to handle tran-

sient currents due to internal logic switching. Additionally, it is

beneficial to have large capacitors (> 47 µF) located at the point

where the power connects to the PCB.

Figure 12 shows a general purpose VFC circuit using a low cost

opto-isolator. A +5 V power supply is assumed for both the

isolated (+5 V isolated) and local (+5 V local) supplies.

+5V

OPTOCOUPLER

AD774x

OUT

GND2

ISOLATION

BARRIER

GND1

Figure 12. Opto-Isolated Application

–11–

REV. 0

1...8 9 101112

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AD7741YRZ	ADI	Single and Multichannel, Synchronous Voltage-to-Frequency Converters	获取价格
AD7742	ADI	Single and Multichannel, Synchronous Voltage-to-Frequency Converters	获取价格
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AD7742BN	ADI	Single and Multichannel, Synchronous Voltage-to-Frequency Converters	获取价格
AD7742BN	ROCHESTER	VOLTAGE-FREQUENCY CONVERTER, 6.144MHz, PDIP16, PLASTIC, DIP-16	获取价格
AD7742BNZ	ROCHESTER	VOLTAGE-FREQUENCY CONVERTER, 6.144MHz, PDIP16, PLASTIC, DIP-16	获取价格

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