是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Active | 零件包装代码: | QLCC |
包装说明: | QCCN, | 针数: | 20 |
Reach Compliance Code: | unknown | 风险等级: | 5.55 |
其他特性: | OVERVOLTAGE PROTECTION | 模拟集成电路 - 其他类型: | SPDT |
JESD-30 代码: | S-CQCC-N20 | JESD-609代码: | e0 |
长度: | 8.89 mm | 湿度敏感等级: | NOT SPECIFIED |
标称负供电电压 (Vsup): | -15 V | 信道数量: | 1 |
功能数量: | 2 | 端子数量: | 20 |
标称断态隔离度: | 85 dB | 通态电阻匹配规范: | 2 Ω |
最大通态电阻 (Ron): | 90 Ω | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | QCCN | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER | 峰值回流温度(摄氏度): | 220 |
认证状态: | MILITARY | 座面最大高度: | 2.54 mm |
标称供电电压 (Vsup): | 15 V | 表面贴装: | YES |
最长断开时间: | 350 ns | 最长接通时间: | 350 ns |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | TIN LEAD | 端子形式: | NO LEAD |
端子节距: | 1.27 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 8.89 mm |
Base Number Matches: | 1 |
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