AD73322L
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted.
Table 5.
Parameters
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Ratings
AVDD, DVDD to GND
AGND to DGND
Digital I/O Voltage to DGND
Analog I/O Voltage to AGND
Operating Temperature Range
Industrial (A Version)
−0.3 V to +4.6 V
−0.3 V to +0.3 V
−0.3 V to (DVDD + 0.3 V)
−0.3 V to (AVDD + 0.3 V)
−40°C to +85°C
−40°C to +105°C
−65°C to +150°C
Extended (Y Version)
Storage Temperature Range
Maximum Junction Temperature 150°C
SOIC, θJA Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 sec)
71.4°C/W
215°C
Infrared (15 sec)
220°C
LQFP, θJA Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 sec)
53.2°C/W
215°C
Infrared (15 sec)
220°C
TSSOP, θJA Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 sec)
97.9°C/W
215°C
220°C
Infrared (15 sec)
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the uman body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. A | Page 9 of 48