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AD73311LARSZ-REEL PDF预览

AD73311LARSZ-REEL

更新时间: 2024-01-18 07:49:38
品牌 Logo 应用领域
亚德诺 - ADI /
页数 文件大小 规格书
36页 333K
描述
Single-Channel, 3 V Front-End Processor for General Purpose Applications Including Speech and Telephony

AD73311LARSZ-REEL 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:SOP, SOP20,.4针数:20
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.07
JESD-30 代码:R-PDSO-G20JESD-609代码:e3
长度:12.8 mm湿度敏感等级:1
功能数量:1端子数量:20
最高工作温度:105 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP20,.4封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
电源:3 V认证状态:Not Qualified
座面最大高度:2.65 mm子类别:Modems
最大压摆率:0.0125 mA标称供电电压:3 V
表面贴装:YES技术:CMOS
电信集成电路类型:TELECOM CIRCUIT温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40宽度:7.5 mm
Base Number Matches:1

AD73311LARSZ-REEL 数据手册

 浏览型号AD73311LARSZ-REEL的Datasheet PDF文件第6页浏览型号AD73311LARSZ-REEL的Datasheet PDF文件第7页浏览型号AD73311LARSZ-REEL的Datasheet PDF文件第8页浏览型号AD73311LARSZ-REEL的Datasheet PDF文件第10页浏览型号AD73311LARSZ-REEL的Datasheet PDF文件第11页浏览型号AD73311LARSZ-REEL的Datasheet PDF文件第12页 
AD73311  
ABSOLUTE MAXIMUM RATINGS*  
(TA = +25°C unless otherwise noted)  
ORDERING GUIDE  
Temperature  
Range  
Package  
AVDD, DVDD to GND . . . . . . . . . . . . . . . . . 0.3 V to +7 V  
AGND to DGND . . . . . . . . . . . . . . . . . . . . . 0.3 V to +0.3 V  
Digital I/O Voltage to DGND . . . . . .0.3 V to DVDD + 0.3 V  
Analog I/O Voltage to AGND . . . . . 0.3 V to AVDD + 0.3 V  
Operating Temperature Range  
Industrial (A Version) . . . . . . . . . . . . . . . . 40°C to +85°C  
Storage Temperature Range . . . . . . . . . . . . 65°C to +150°C  
Maximum Junction Temperature . . . . . . . . . . . . . . . . +150°C  
SOIC, θJA Thermal Impedance . . . . . . . . . . . . . . . . . . 75°C/W  
Lead Temperature, Soldering  
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215°C  
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C  
SSOP, θJA Thermal Impedance . . . . . . . . . . . . . . . . . . 90°C/W  
Lead Temperature, Soldering  
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215°C  
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C  
*Stresses above those listed under Absolute Maximum Ratings may cause perma-  
nent damage to the device. This is a stress rating only; functional operation of the  
device at these or any other conditions above those listed in the operational  
sections of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability.  
Model  
Option1  
AD73311AR  
AD73311ARS  
EVAL-AD73311EB  
40°C to +85°C  
R-20  
RS-20  
40°C to +85°C  
Evaluation Board2  
+EZ-KIT Lite Upgrade3  
Evaluation Board2  
+EZ-KIT Lite4  
EVAL-AD73311EZ  
NOTES  
1R = 0.3' Small Outline IC (SOIC), RS = Shrink Small Outline Package (SSOP).  
2The AD73311 evaluation board features a selectable number of codecs in  
cascade (from 1 to 4). It can be interfaced to an ADSP-2181 EZ-KIT Lite or  
to a Texas Instruments EVM kit.  
3The upgrade consists of a replacement PROM and connector. This option is  
intended for existing owners of EZ-KIT Lite.  
4The EZ-KIT Lite has been modified to allow it to interface with the AD73311  
evaluation board. This option is intended for users who do not already have an  
EZ-KIT Lite.  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection.  
Although the AD73311 features proprietary ESD protection circuitry, permanent damage may  
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD  
precautions are recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
PIN CONFIGURATION  
VOUTP  
20  
19  
1
2
3
4
5
6
7
8
9
SE  
VOUTN  
AVDD1  
AGND1  
VINP  
SDI  
18 SDIFS  
17 SDOFS  
SDO  
16  
15  
14  
13  
12  
11  
AD73311  
TOP VIEW  
(Not to Scale)  
MCLK  
SCLK  
RESET  
DVDD  
VINN  
REFOUT  
REFCAP  
AVDD2  
DGND  
AGND2 10  
REV. B  
–9–  

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