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AD7276AUJZ-REEL7 PDF预览

AD7276AUJZ-REEL7

更新时间： 2024-02-09 08:40:18
品牌 Logo 应用领域
亚德诺 - ADI 转换器模数转换器光电二极管PC
页数 文件大小 规格书
28页 501K
描述
3 MSPS, 12-/10-/8-Bit ADCs in 6-Lead TSOT

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AD7276AUJZ-REEL7 技术参数

Source Url Status Check Date：2013-05-01 14:56:17.256是否无铅： 含铅
是否Rohs认证： 符合生命周期：Active
零件包装代码：TSSOP包装说明：VSSOP, TSOP6,.11,37
针数：6Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8542.39.00.01
风险等级：1.13Samacsys Confidence：3
Samacsys Status：ReleasedSamacsys PartID：325993
Samacsys Pin Count：6Samacsys Part Category：Integrated Circuit
Samacsys Package Category：SOT23 (6-Pin)Samacsys Footprint Name：UJ-6 (TSOT)
Samacsys Released Date：2017-01-11 11:21:59Is Samacsys：N
最大模拟输入电压：3.6 V最小模拟输入电压：
最长转换时间：0.291 µs转换器类型：ADC, SUCCESSIVE APPROXIMATION
JESD-30 代码：R-PDSO-G6JESD-609代码：e4
长度：2.9 mm最大线性误差 (EL)：0.0366%
湿度敏感等级：1模拟输入通道数量：1
位数：12功能数量：1
端子数量：6最高工作温度：125 °C
最低工作温度：-40 °C输出位码：BINARY
输出格式：SERIAL封装主体材料：PLASTIC/EPOXY
封装代码：VSSOP封装等效代码：TSOP6,.11,37
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）：NOT SPECIFIED电源：2.5/3.3 V
认证状态：Not Qualified采样速率：3 MHz
采样并保持/跟踪并保持：TRACK座面最大高度：1 mm
子类别：Analog to Digital Converters标称供电电压：3 V
表面贴装：YES技术：CMOS
温度等级：AUTOMOTIVE端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：GULL WING端子节距：0.95 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：1.6 mmBase Number Matches：1

AD7276AUJZ-REEL7 数据手册

 浏览型号AD7276AUJZ-REEL7的Datasheet PDF文件第22页浏览型号AD7276AUJZ-REEL7的Datasheet PDF文件第23页浏览型号AD7276AUJZ-REEL7的Datasheet PDF文件第24页浏览型号AD7276AUJZ-REEL7的Datasheet PDF文件第26页浏览型号AD7276AUJZ-REEL7的Datasheet PDF文件第27页浏览型号AD7276AUJZ-REEL7的Datasheet PDF文件第28页 
AD7276/AD7277/AD7278  
APPLICATION HINTS  
Good decoupling is also important. All analog supplies should  
be decoupled with 10 μF ceramic capacitors in parallel with  
0.1 μF capacitors to GND. To achieve the best results from these  
decoupling components, they must be placed as close as possible  
to the device, ideally right up against the device. The 0.1 μF  
capacitors should have low effective series resistance (ESR) and  
low effective series inductance (ESI), such as is typical of common  
ceramic or surface-mount types of capacitors. Capacitors with  
low ESR and low ESI provide a low impedance path to ground  
at high frequencies, which allow them to handle transient  
currents due to internal logic switching.  
GROUNDING AND LAYOUT  
The printed circuit board that houses the AD7276/AD7277/  
AD7278 should be designed so that the analog and digital  
sections are separated and confined to certain areas of the  
board. This design facilitates using ground planes that can easily  
be separated.  
To provide optimum shielding for ground planes, a minimum  
etch technique is generally best. All AGND pins of the AD7276/  
AD7277/AD7278 should be sunk into the AGND plane. Digital  
and analog ground planes should be joined in one place only. If  
the AD7276/AD7277/AD7278 are in a system where multiple  
devices require an AGND-to-DGND connection, the connection  
should still be made at only one point, a star ground point  
established as close as possible to the ground pin on the  
AD7276/AD7277/AD7278.  
EVALUATING PERFORMANCE  
The recommended layout for the AD7276/AD7277/AD7278 is  
outlined in the evaluation board documentation. The evaluation  
board package includes a fully assembled and tested evaluation  
board, documentation, and software for controlling the board  
from the PC via the evaluation board controller. To demonstrate/  
evaluate the ac and dc performance of the AD7276/AD7277,  
the evaluation board controller can be used in conjunction with  
the AD7276/AD7277 evaluation board, as well as with many  
other Analog Devices evaluation boards ending in the CB  
designator,  
Avoid running digital lines under the device because this  
couples noise onto the die. However, the analog ground plane  
should be allowed to run under the AD7276/AD7277/AD7278  
to avoid noise coupling. The power supply lines to the AD7276/  
AD7277/AD7278 should use as large a trace as possible to provide  
low impedance paths and reduce the effects of glitches on the  
power supply line.  
The software allows the user to perform ac (fast Fourier  
transform) and dc (histogram of codes) tests on the AD7276/  
AD7277. The software and documentation are on a CD shipped  
with the evaluation board.  
To avoid radiating noise to other sections of the board,  
components with fast-switching signals, such as clocks, should  
be shielded with digital ground, and they should never be run  
near the analog inputs. Avoid crossover of digital and analog  
signals. To reduce the effects of feedthrough within the board,  
traces on opposite sides of the board should run at right angles  
to each other. A microstrip technique is by far the best method,  
but it is not always possible to use this approach with a double-  
sided board. In this technique, the component side of the board  
is dedicated to ground planes, and signals are placed on the  
solder side.  
Rev. C | Page 25 of 28  
 
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