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AD7273BUJZ-REEL7 PDF预览

AD7273BUJZ-REEL7

更新时间： 2024-01-02 07:52:40
品牌 Logo 应用领域
亚德诺 - ADI 光电二极管转换器
页数 文件大小 规格书
28页 390K
描述
3 MSPS 10-Bit ADC in TSOT and MSOP Packages

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中文翻译

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AD7273BUJZ-REEL7 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：TSSOP
包装说明：VSSOP,针数：8
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.39
最大模拟输入电压：3.6 V最小模拟输入电压：
最长转换时间：0.25 µs转换器类型：ADC, SUCCESSIVE APPROXIMATION
JESD-30 代码：R-PDSO-G8JESD-609代码：e4
长度：2.9 mm最大线性误差 (EL)：0.0488%
湿度敏感等级：1模拟输入通道数量：1
位数：10功能数量：1
端子数量：8最高工作温度：125 °C
最低工作温度：-40 °C输出位码：BINARY
输出格式：SERIAL封装主体材料：PLASTIC/EPOXY
封装代码：VSSOP封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH峰值回流温度（摄氏度）：260
认证状态：Not Qualified采样速率：3 MHz
采样并保持/跟踪并保持：TRACK座面最大高度：0.9 mm
标称供电电压：3 V表面贴装：YES
温度等级：AUTOMOTIVE端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：GULL WING端子节距：0.65 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：1.6 mmBase Number Matches：1

AD7273BUJZ-REEL7 数据手册

 浏览型号AD7273BUJZ-REEL7的Datasheet PDF文件第21页浏览型号AD7273BUJZ-REEL7的Datasheet PDF文件第22页浏览型号AD7273BUJZ-REEL7的Datasheet PDF文件第23页浏览型号AD7273BUJZ-REEL7的Datasheet PDF文件第25页浏览型号AD7273BUJZ-REEL7的Datasheet PDF文件第26页浏览型号AD7273BUJZ-REEL7的Datasheet PDF文件第27页 
AD7273/AD7274  
APPLICATION HINTS  
Good decoupling is also important. All analog supplies should  
be decoupled with 10 ꢀF ceramic capacitors in parallel with  
0.1 ꢀF capacitors to AGND/DGND. To achieve the best results  
from these decoupling components, they must be placed as close  
as possible to the device, ideally right up against the device. The  
0.1 ꢀF capacitors should have low effective series resistance  
(ESR) and low effective series inductance (ESI), such as is typical  
of common ceramic or surface-mount types of capacitors.  
Capacitors with low ESR and low ESI provide a low impedance  
path to ground at high frequencies, which allows them to  
handle transient currents due to internal logic switching.  
GROUNDING AND LAYOUT  
The printed circuit board that houses the AD7273/AD7274  
should be designed so that the analog and digital sections are  
separated and confined to certain areas of the board. This design  
facilitates using ground planes that can be easily separated.  
To provide optimum shielding for ground planes, a minimum  
etch technique is generally best. All AGND pins of the AD7273/  
AD7274 should be sunk into the AGND plane. Digital and  
analog ground planes should be joined in only one place. If the  
AD7273/AD7274 are in a system where multiple devices require  
an AGND-to-DGND connection, the connection should be  
made at only one point, a star ground point, established as close  
as possible to the ground pin on the AD7273/AD7274.  
EVALUATING THE AD7273/AD7274 PERFORMANCE  
The recommended layout for the AD7273/AD7274 is outlined  
in the evaluation board documentation. The evaluation board  
package includes a fully assembled and tested evaluation board,  
documentation, and software for controlling the board from a  
PC via the evaluation board controller. The evaluation board  
controller can be used in conjunction with the AD7273/AD7274  
evaluation board, as well as many other Analog Devices evaluation  
boards ending in the CB designator, to demonstrate/evaluate the  
ac and dc performance of the AD7273/AD7274.  
Avoid running digital lines under the device, because this  
couples noise onto the die. However, the analog ground plane  
should be allowed to run under the AD7273/AD7274 to avoid  
noise coupling. The power supply lines to the AD7273/AD7274  
should use as large a trace as possible to provide low impedance  
paths and reduce the effects of glitches on the power supply line.  
To avoid radiating noise to other sections of the board,  
components with fast-switching signals, such as clocks, should  
be shielded with digital ground, and they should never be run  
near the analog inputs. Avoid crossover of digital and analog  
signals. To reduce the effects of feedthrough within the board,  
traces on opposite sides of the board should run at right angles  
to each other. A microstrip technique is by far the best method,  
but it is not always possible to use this approach with a double-  
sided board. In this technique, the component side of the board  
is dedicated to ground planes, and signals are placed on the  
solder side.  
The software allows the user to perform ac (fast Fourier trans-  
form) and dc (histogram of codes) tests on the AD7273/AD7274.  
The software and documentation are on a CD shipped with the  
evaluation board.  
Rev. 0 | Page 24 of 28  
 
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