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AD5621AKSZ-500RL7 PDF预览

AD5621AKSZ-500RL7

更新时间： 2024-02-03 10:20:01
品牌 Logo 应用领域
亚德诺 - ADI 转换器数模转换器光电二极管PC
页数 文件大小 规格书
24页 466K
描述
2.7 V to 5.5 V, <100 μA, 8-/10-/12-Bit nanoDAC, SPI Interface in LFCSP and SC70

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中文翻译

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AD5621AKSZ-500RL7 技术参数

是否无铅：含铅是否Rohs认证：符合
生命周期：Active零件包装代码：TSSOP
包装说明：TSSOP, TSSOP6,.08针数：6
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：1.16
Samacsys Confidence：3Samacsys Status：Released
Samacsys PartID：2104Samacsys Pin Count：6
Samacsys Part Category：Integrated CircuitSamacsys Package Category：SOT23 (6-Pin)
Samacsys Footprint Name：KS-6 (SC70)Samacsys Released Date：2015-04-16 09:48:08
Is Samacsys：N最大模拟输出电压：5.5 V
最小模拟输出电压：转换器类型：D/A CONVERTER
输入位码：BINARY输入格式：SERIAL
JESD-30 代码：R-PDSO-G6JESD-609代码：e4
长度：2 mm最大线性误差 (EL)：0.1465%
湿度敏感等级：1位数：12
功能数量：1端子数量：6
最高工作温度：125 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：TSSOP
封装等效代码：TSSOP6,.08封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度（摄氏度）：260
电源：3/5 V认证状态：Not Qualified
座面最大高度：1.1 mm最大稳定时间：10 µs
标称安定时间 (tstl)：6 µs子类别：Other Converters
标称供电电压：5 V表面贴装：YES
技术：CMOS温度等级：AUTOMOTIVE
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：0.65 mm端子位置：DUAL
处于峰值回流温度下的最长时间：40宽度：1.25 mm
Base Number Matches：1

AD5621AKSZ-500RL7 数据手册

 浏览型号AD5621AKSZ-500RL7的Datasheet PDF文件第16页浏览型号AD5621AKSZ-500RL7的Datasheet PDF文件第17页浏览型号AD5621AKSZ-500RL7的Datasheet PDF文件第18页浏览型号AD5621AKSZ-500RL7的Datasheet PDF文件第20页浏览型号AD5621AKSZ-500RL7的Datasheet PDF文件第21页浏览型号AD5621AKSZ-500RL7的Datasheet PDF文件第22页 
Data Sheet  
AD5601/AD5611/AD5621  
USING THE AD5601/AD5611/AD5621 WITH A  
GALVANICALLY ISOLATED INTERFACE  
POWER SUPPLY BYPASSING AND GROUNDING  
When accuracy is important in a circuit, it is helpful to carefully  
consider the power supply and ground return layout on the  
board. The PCB containing the AD5601/AD5611/AD5621  
should have separate analog and digital sections, each having its  
own area of the board. If the AD5601/AD5611/AD5621 are in a  
system where other devices require an AGND-to-DGND  
connection, the connection should be made at one point only.  
This ground point should be as close as possible to the  
AD5601/AD5611/AD5621.  
In process control applications in industrial environments,  
it is often necessary to use a galvanically isolated interface to  
protect and isolate the controlling circuitry from any hazardous  
common-mode voltages that might occur in the area where the  
DAC is functioning. iCoupler® provides isolation in excess of  
2.5 kV. Because the AD5601/AD5611/AD5621 use a 3-wire serial  
logic interface, the ADuM1300 3-channel digital isolator  
provides the required isolation (see Figure 53). The power  
supply to the part also needs to be isolated, which is done by  
using a transformer. On the DAC side of the transformer, a 5 V  
regulator provides the 5 V supply required for the AD5601/  
AD5611/AD5621.  
The power supply to the AD5601/AD5611/AD5621 should be  
bypassed with 10 µF and 0.1 µF capacitors. The capacitors  
should be physically as close as possible to the device, with the  
0.1 µF capacitor ideally right up against the device. The 10 µF  
capacitors are the tantalum bead type. It is important that the  
0.1 µF capacitor have low effective series resistance (ESR) and  
effective series inductance (ESI), such as in common ceramic  
types of capacitors. This 0.1 µF capacitor provides a low imped-  
ance path to ground for high frequencies caused by transient  
currents due to internal logic switching.  
5V  
REGULATOR  
POWER  
10µF  
0.1µF  
V
DD  
SCLK  
V
V
SCLK  
IA  
OA  
The power supply line itself should have as large a trace as  
possible to provide a low impedance path and reduce glitch  
effects on the supply line. Clocks and other fast switching  
digital signals should be shielded from other parts of the board  
by digital ground. Avoid crossover of digital and analog signals,  
if possible. When traces cross on opposite sides of the board,  
ensure that they run at right angles to each other to reduce  
feedthrough effects on the board. The best board layout tech-  
nique is the microstrip technique, where the component side of  
the board is dedicated to the ground plane only and the signal  
traces are placed on the solder side. However, this is not always  
possible with a two-layer board.  
ADuM1300  
AD5601/  
AD5611/  
AD5621  
V
OUT  
SDI  
V
V
V
V
SYNC  
SDIN  
IB  
IC  
OB  
OC  
DATA  
GND  
Figure 53. AD5601/AD5611/AD5621 with a Galvanically Isolated Interface  
Rev. G | Page 19 of 24  
 
 
 
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中文翻译

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AD5621AKSZ-500RL7 替代型号

型号 品牌 替代类型 描述 数据表
DAC7311IDCKT TI

功能相似

 		1.8V to 5.5V, 80mA, 8-, 10-, and 12-Bit, Low-Power, Single-Channel,
DAC7311IDCKR TI

功能相似

 		1.8V to 5.5V, 80mA, 8-, 10-, and 12-Bit, Low-Power, Single-Channel,

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