AD5306/AD5316/AD5326
POWER SUPPLY DECOUPLING
In any circuit where accuracy is important, careful consideration
of the power supply and ground return layout helps to ensure
the rated performance. The printed circuit board on which the
AD5306/AD5316/AD5326 is mounted should be designed so
the analog and digital sections are separated and confined to
certain areas of the board.
The power supply lines of the AD5306/AD5316/AD5326 should
use as large a trace as possible to provide low impedance paths
and reduce the effects of glitches on the power supply line.
Components with fast-switching signals, such as clocks, should
be shielded with digital ground to avoid radiating noise to other
parts of the board, and they should never be run near the
reference inputs. A ground line routed between the SDA and
SCL lines helps to reduce crosstalk between them. Although a
ground line is not required on a multilayer board because there is
a separate ground plane, separating the lines helps.
If the AD5306/AD5316/AD5326 is in a system where multiple
devices require an AGND-to-DGND connection, the connection
should be made at one point only. The star ground point should
be established as close as possible to the device. The AD5306/
AD5316/AD5326 should have ample supply bypassing of 10 μF
in parallel with 0.1 μF on the supply located as close to the
package as possible, ideally right up against the device. The 10 μF
capacitors are the tantalum bead type. The 0.1 μF capacitor should
have low effective series resistance (ESR) and low effective
series inductance (ESI), like the common ceramic types that
provide a low impedance path to ground at high frequencies to
handle transient currents due to internal logic switching.
Avoid crossover of digital and analog signals. Traces on opposite
sides of the board should run at right angles to each other. This
reduces the effects of feedthrough through the board. A micro-
strip technique is the best method, but its use is not always
possible with a double-sided board. In this technique, the
component side of the board is dedicated to ground plane while
signal traces are placed on the solder side.
Table 8. Overview of AD53xx Serial Devices1
Part No.
SINGꢀES
AD5300
AD5310
AD5320
AD5301
AD5311
AD5321
DUAꢀS
AD5302
AD5312
AD5322
AD5303
AD5313
AD5323
QUADS
AD5304
AD5314
AD5324
AD5305
AD5315
AD5325
AD5306
AD5316
AD5326
AD5307
AD5317
AD5327
OCTAꢀS
AD5308
AD5318
AD5328
Resolution
No. of DACs
DNꢀ
0.25
0.5
1.0
0.25
0.5
1.0
Interface
Settling Time (μs) Package
Pins
8
1
1
1
1
1
1
SPI
SPI
SPI
2-wire
2-wire
2-wire
4
6
8
6
7
8
SOT-23, MSOP
6, 8
6, 8
6, 8
6, 8
6, 8
6, 8
10
12
8
10
12
SOT-23, MSOP
SOT-23, MSOP
SOT-23, MSOP
SOT-23, MSOP
SOT-23, MSOP
8
2
2
2
2
2
2
0.25
0.5
1.0
0.25
0.5
1.0
SPI
SPI
SPI
SPI
SPI
SPI
6
7
8
6
7
8
MSOP
MSOP
MSOP
TSSOP
TSSOP
TSSOP
8
8
8
16
16
16
10
12
8
10
12
8
4
4
4
4
4
4
4
4
4
4
4
4
0.25
0.5
1.0
0.25
0.5
1.0
0.25
0.5
1.0
0.25
0.5
1.0
SPI
SPI
SPI
2-Wire
2-Wire
2-Wire
2-Wire
2-Wire
2-Wire
SPI
6
7
8
6
7
8
6
7
8
6
7
8
MSOP
MSOP
MSOP
MSOP
MSOP
MSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
10
10
10
10
10
10
16
16
16
16
16
16
10
12
8
10
12
8
10
12
8
10
12
SPI
SPI
8
10
12
8
8
8
0.25
0.5
1.0
SPI
SPI
SPI
6
7
8
TSSOP
TSSOP
TSSOP
16
16
16
1 Visit www.analog.com/support/standard_linear/selection_guides/AD53xx.html for more information.
Rev. F | Page 22 of 24
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