Datasheet > AD5313BRU-REEL7

AD5313BRU-REEL7

更新时间： 2024-01-09 12:06:53

品牌	Logo	应用领域
罗彻斯特 - ROCHESTER		输入元件光电二极管转换器
页数	文件大小	规格书
29页	1603K
描述
SERIAL INPUT LOADING, 7us SETTLING TIME, 10-BIT DAC, PDSO16, MO-153AB, TSSOP-16

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AD5313BRU-REEL7 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Active	零件包装代码：	TSSOP
包装说明：	MO-153AB, TSSOP-16	针数：	16
Reach Compliance Code：	unknown	风险等级：	5.18
最大模拟输出电压：	5.499 V	最小模拟输出电压：	0.001 V
转换器类型：	D/A CONVERTER	输入位码：	BINARY
输入格式：	SERIAL	JESD-30 代码：	R-PDSO-G16
JESD-609代码：	e0	长度：	5 mm
最大线性误差 (EL)：	0.1953%	湿度敏感等级：	1
位数：	10	功能数量：	1
端子数量：	16	最高工作温度：	105 °C
最低工作温度：	-40 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	TSSOP	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	峰值回流温度（摄氏度）：	240
认证状态：	COMMERCIAL	座面最大高度：	1.2 mm
标称安定时间 (tstl)：	7 µs	标称供电电压：	3 V
表面贴装：	YES	技术：	CMOS
温度等级：	INDUSTRIAL	端子面层：	TIN LEAD
端子形式：	GULL WING	端子节距：	0.65 mm
端子位置：	DUAL	处于峰值回流温度下的最长时间：	30
宽度：	4.4 mm	Base Number Matches：	1

AD5313BRU-REEL7 数据手册

AD5303/AD5313/AD5323

t₁

SCLK

t₂

t₁₄

t₃

t₈

t₄

t₆

SYNC

t₁₅

t₅

DIN

DB15

DB0

DB15

DB0

INPUT WORD FOR DAC N

UNDEFINED

INPUT WORD FOR DAC (N+1)

INPUT WORD FOR DAC N

SDO

SCLK

SDO

t₁₃

t₁₂

Figure 47. Daisy-Chaining Timing Diagram

(ESI), like the common ceramic types that provide a low

impedance path to ground at high frequencies to handle

transient currents due to internal logic switching.

POWER SUPPLY BYPASSING AND GROUNDING

In any circuit where accuracy is important, careful considera-

tion of the power supply and ground return layout helps to

ensure the rated performance. The printed circuit board on

which the AD5303/AD5313/AD5323 are mounted should be

designed so that the analog and digital sections are separated

and confined to certain areas of the board. If the AD5303/

AD5313/AD5323 are in a system where multiple devices

require an AGND-to-DGND connection, the connection

should be made at one point only. The star ground point

should be established as close as possible to the AD5303/

AD5313/AD5323. The AD5303/AD5313/AD5323 should

have ample supply bypassing of 10 μF in parallel with 0.1 μF

on the supply located as close to the package as possible, ideally

right up against the device. Use 10 μF capacitors that are of the

tantalum bead type. The 0.1 μF capacitor should have low

effective series resistance (ESR) and effective series inductance

The power supply lines of the AD5303/AD5313/AD5323 should

use as large a trace as possible to provide low impedance paths

and reduce the effects of glitches on the power supply line. Fast

switching signals such as clocks should be shielded with digital

ground to avoid radiating noise to other parts of the board, and

should never be run near the reference inputs. Avoid crossover

of digital and analog signals. Traces on opposite sides of the

board should run at right angles to each other. This reduces

the effects of feedthrough through the board. A microstrip

technique is by far the best, but is not always possible with a

double-sided board. In this technique, the component side of

the board is dedicated to the ground plane while signal traces

are placed on the solder side.

Rev. B | Page 24 of 28

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