AD5259
OUTLINE DIMENSIONS
INDEX
AREA
3.00 BSC
PIN 1
INDICATOR
3.00
BSC SQ
10
6
10
1
1.50
BCS SQ
4.90 BSC
3.00 BSC
PIN 1
0.50
BSC
2.48
2.38
2.23
EXPOSED
1
5
PAD
TOP VIEW
(BOTTOM VIEW)
6
5
0.50 BSC
0.95
0.85
0.75
0.50
0.40
0.30
1.74
1.64
1.49
1.10 MAX
0.80 MAX
0.55 TYP
0.80
0.75
0.70
0.80
0.60
0.40
8°
0°
0.15
0.00
0.27
0.17
0.05 MAX
0.02 NOM
SEATING
PLANE
SIDE VIEW
0.23
0.08
COPLANARITY
0.10
SEATING
PLANE
0.30
0.23
0.18
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-187-BA
Figure 48. 10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Figure 49. 10-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-10-9)
Dimensions shown in millimeters
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD5259BRMZ51
Package Description
Package Option
RAB (Ω)
5 k
5 k
5 k
1± k
1± k
1± k
5± k
5± k
5± k
1±± k
1±± k
1±± k
Temperature
–4±°C to +85°C
–4±°C to +85°C
–4±°C to +85°C
–4±°C to +85°C
–4±°C to +85°C
–4±°C to +85°C
–4±°C to +85°C
–4±°C to +85°C
–4±°C to +85°C
–4±°C to +85°C
–4±°C to +85°C
–4±°C to +85°C
Branding
D4P
D4P
1±-Lead MSOP
1±-Lead MSOP
1±-Lead LFCSP_WD
1±-Lead MSOP
1±-Lead MSOP
1±-Lead LFCSP_WD
1±-Lead MSOP
1±-Lead MSOP
1±-Lead LFCSP_WD
1±-Lead MSOP
1±-Lead MSOP
RM-1±
RM-1±
CP-1±-9
RM-1±
RM-1±
CP-1±-9
RM-1±
RM-1±
CP-1±-9
RM-1±
RM-1±
CP-1±-9
AD5259BRMZ5-R71
AD5259BCPZ5-R71
AD5259BRMZ1±1
AD5259BRMZ1±-R71
AD5259BCPZ1±-R71
AD5259BRMZ5±1
AD5259BRMZ5±-R71
AD5259BCPZ5±-R71
AD5259BRMZ1±±1
AD5259BRMZ1±±-R71
AD5259BCPZ1±±-R71
AD5259EVAL2
D4P
D4Q
D4Q
D4Q
D4R
D4R
D4R
D4S
D4S
D4S
1±-Lead LFCSP_WD
Evaluation Board
1 Z = Pb-free part.
2 The evaluation board is shipped with the 1± kΩ RAB resistor option; however, the board is compatible with all available resistor value options.
Rev. A | Page 21 of 24