Datasheet > ACPM-7886_09

ACPM-7886_09

更新时间： 2022-06-02 07:40:22

品牌	Logo	应用领域
安华高科 - AVAGO		放大器
页数	文件大小	规格书
14页	380K
描述
TD-SCDMA Power Amplifier

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ACPM-7886_09 数据手册

Solder Paste Recommendation

Background

The ACPM-7886 package is a lead free package that was In 1999 the China Academy of Telecommunications Tech-

proven to pass MSL3 when reﬂowed under lead free nology (CATT) and Siemens proposed a new 3G standard

solder reﬂow proﬁle. The recommended lead free solder

that would rival WCDMA and CDMA2000 data rates. Time

for SMT reﬂow is Sn-Ag-Cu (95.5% Tin, 3.8% Silver, 0.7% Domain Synchronous Code Domain Access (TD-SCDMA)

Copper) or other similar Sn-Ag-Cu solders. This lead combines both CDMA and TDMA technologies. It ben-

free solder paste has a melting point of 218°C (423°F), eﬁts from CDMA capacity as well as being compatible

the ternary eutectic of Sn-Ag-Cu system, giving it the

with current GSM networks. But unlike existing WCDMA,

advantage of being the lowest melting lead free alterna- CDMA2000 and GSM networks, this new standard trans-

tive. This temperature is still low enough to protect from mits and receives on the same frequency thus greatly

damaging the internal circuitry during solder reﬂow

increasing spectrum eﬃciency. Figure 6 simpliﬁes this

operations provided the exposure time at peak reﬂow explanation by showing one TD-SCDMA frame with 7

temperatures is not too excessive.

slots and 16 channelization codes in each slot.

In certain situations, the designer may use leaded solder

paste for reﬂow. The recommended solder for mounting

ACPM-7886 package is Sn63 (63% Sn, 37% Pb). It is a

eutectic compound with a typical melting point of 183°C.

ACPM-7886 Test Setup

The test setup for measuring a TD-SCDMA power module

resembles a GSM test. Speciﬁcally, it is very important to

properly conﬁgure the timing for the test instruments

and the device under test. In GSM, in order to turn ON

and OFF each time slot, a controlled pin on the PA is trig-

gered with a pulse period of 4.615ms and a 12% duty

cycle (577uS). This pin is usually labeled as Vapc on most

GSM PAs.

Application Information

Introduction

The ACPM-7886 ampliﬁer module is designed for TD-

SCDMA applications in the 2010-2025MHz band. This

power ampliﬁer is able to produce excellent results for

the emerging Chinese standard, TD-SCDMA. Typical

ACLR performance at Vdd is 41dBc with Pout of 28dBm

and 41% eﬃciency.

Figure 6. TD-SCDMA frame.^[1]

1...7 8 91011 12 13 14

中文翻译

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