Datasheet > ACPM-7372

ACPM-7372

更新时间： 2022-02-26 12:32:36

品牌	Logo	应用领域
安华高科 - AVAGO		/
页数	文件大小	规格书
16页	1336K
描述
high efficiency at max output power

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ACPM-7372 数据手册

Metallization

PCB Design Guidelines

The recommended PCB land pattern is shown in ﬁgures

on the left side. The substrate is coated with solder mask

between the I/O and conductive paddle to protect the

gold pads from short circuit that is caused by solder

bleeding/bridging.

0.1

0.6

0.4

Stencil Design Guidelines

A properly designed solder screen or stencil is required

to ensure optimum amount of solder paste is deposited

onto the PCB pads.

0.85

The recommended stencil layout is shown here. ꢁeducing

the stencil opening can potentially generate more voids.

On the other hand, stencil openings larger than 100% will

lead to excessive solder paste smear or bridging across

the I/O pads or conductive paddle to adjacent I/O pads.

Considering the fact that solder paste thickness will

directly aﬀect the quality of the solder joint, a good choice

is to use laser cut stencil composed of 0.100mm(4mils) or

0.127mm(5mils) thick stainless steel which is capable of

producing the required ﬁne stencil outline.

0.25

0.5

Ø0.3mm

on 0.6mm pitch

Solder Mask Opening

0.7

0.55

0.5

1.8

0.85

2.4

Solder Paste Stencil Aperture

0.6

0.5

0.4

1.6

0.85

2.0

1...5 6 789 10 11...16

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ACPM-7381-OR1	AVAGO	1920MHz - 1980MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER, 4 X 4 MM, 1.10 MM HEIGHT,	获取价格