Datasheet > 射频和微波 > 射频/微波放大器> ACPM-7371-TR1

ACPM-7371-TR1

更新时间： 2024-02-29 00:04:18

品牌	Logo	应用领域
安华高科 - AVAGO		射频和微波射频放大器微波放大器功率放大器
页数	文件大小	规格书
15页	877K
描述
UMTS 4x4 Power Amplifier (880-915MHz)

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中文翻译

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技术参数
数据手册

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ACPM-7371-TR1 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
包装说明：	SOLCC10,.16,32	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8542.33.00.01
风险等级：	5.84	Is Samacsys：	N
特性阻抗：	50 Ω	构造：	COMPONENT
增益：	11.5 dB	最大输入功率 (CW)：	10 dBm
安装特点：	SURFACE MOUNT	功能数量：	1
端子数量：	10	最大工作频率：	915 MHz
最小工作频率：	880 MHz	最高工作温度：	90 °C
最低工作温度：	-20 °C	封装主体材料：	PLASTIC/EPOXY
封装等效代码：	SOLCC10,.16,32	电源：	3.4 V
射频/微波设备类型：	NARROW BAND MEDIUM POWER	子类别：	RF/Microwave Amplifiers
最大压摆率：	535 mA	表面贴装：	YES
最大电压驻波比：	2.5	Base Number Matches：	1

ACPM-7371-TR1 数据手册

Storage Condition

Baking of Populated Boards

Packages described in this document must be stored

in sealed moisture barrier, antistatic bags. Shelf life in a

sealed moisture barrier bag is 12 months at <40°C and

90% relative humidity (RH) J-STD-033 p.7.

Some SMD packages and board materials are not able to

withstand long duration bakes at 125°C. Examples of this

are some FR-4 materials, which cannot withstand a 24 hr

bake at 125°C. Batteries and electrolytic capacitors are

also temperature sensitive. With component and board

temperature restrictions in mind, choose a bake tem-

perature from Table 4-1 in J-STD 033; then determine the

appropriate bake duration based on the component to

be removed. For additional considerations see IPC-7711

andIPC-7721.

Out-of-Bag Time Duration

After unpacking the device must be soldered to the PCB

within 168 hours as listed in the J-STD-020B p.11 with

factory conditions <30°C and 60% RH.

Baking

Derating due to Factory Environmental Conditions

It is not necessary to re-bake the part if both conditions

(storage conditions and out-of bag conditions) have been

satisﬁed. Baking must be done if at least one of the con-

ditions above have not been satisﬁed. The baking condi-

tions are 125°C for 12 hours J-STD-033 p.8.

Factory ﬂoor life exposures for SMD packages removed

from the dry bags will be a function of the ambient envi-

ronmental conditions. A safe, yet conservative, handling

approach is to expose the SMD packages only up to the

maximum time limits for each moisture sensitivity level as

shown in Table 6. This approach, however, does not work

if the factory humidity or temperature is greater than the

testing conditions of 30°/60% RH. A solution for address-

ing this problem is to derate the exposure times based on

the knowledge of moisture diﬀusion in the component

package materials ref. JESD22-A120). Recommended

equivalent total ﬂoor life exposures can be estimated for

a range of humidities and temperatures based on the

nominal plastic thickness for each device.

CAUTION

Tape and reel materials typically cannot be baked at the

temperature described above. If out-of-bag exposure

time is exceeded, parts must be baked for a longer time

at low temperatures, or the parts must be de-reeled, de-

taped, re-baked and then put back on tape and reel. (See

moisture sensitive warning label on each shipping bag

for information of baking).

Board Rework

Table 8 lists equivalent derated ﬂoor lives for humidities

ranging from 20-90% RH for three temperature, 20°, 25°,

and 30°C.

Component Removal, Rework and Remount

If a component is to be removed from the board, it is

recommended that localized heating be used and the

maximum body temperatures of any surface mount

component on the board not exceed 200°C. This method

will minimize moisture related component damage. If any

component temperature exceeds 200°C, the board must

be baked dry per 4-2 prior to rework and/or component

removal. Component temperatures shall be measured at

the top center of the package body. Any SMD packages

that have not exceeded their ﬂoor life can be exposed to

a maximum body temperature as high as their speciﬁed

maximum reﬂow temperature.

This table is applicable to SMDs molded with novolac,

biphenyl or multifunctional epoxy mold compounds. The

following assumptions were used in calculating Table 9:

1. Activation Energy for diﬀusion = 0.35eV (smallest

known value).

2. For ≤60% RH, use Diﬀusivity = 0.121exp ( -0.35eV/kT)

mm2/s (this used smallest known Diﬀusivity @ 30°C).

3. For >60% RH, use Diﬀusivity = 1.320exp ( -0.35eV/kT)

mm2/s (this used largest known Diﬀusivity @ 30°C).

Removal for Failure Analysis

Not following the above requirements may cause

moisture/reﬂow damage that could hinder or com-

pletely prevent the determination of the original failure

mechanism.

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与ACPM-7371-TR1相关器件

型号	品牌	获取价格	描述	数据表
ACPM-7372	AVAGO	获取价格	high efficiency at max output power
ACPM-7372-BLK	AVAGO	获取价格	high efficiency at max output power
ACPM-7372-TR1	AVAGO	获取价格	high efficiency at max output power
ACPM-7381	AVAGO	获取价格	1920MHz - 1980MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER, 4 X 4 MM, 1.10 MM HEIGHT,
ACPM-7381-BLK	AVAGO	获取价格	UMTS2100 4x4 Power Amplifier (1920-1980MHz)
ACPM-7381-BLKR	AVAGO	获取价格	1920MHz - 1980MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER, 4 X 4 MM, 1.10 MM HEIGHT,
ACPM-7381-OR1	AVAGO	获取价格	1920MHz - 1980MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER, 4 X 4 MM, 1.10 MM HEIGHT,
ACPM-7381-TR1	AVAGO	获取价格	UMTS2100 4x4 Power Amplifier (1920-1980MHz)
ACPM-7382	AVAGO	获取价格	Lead-free, RoHS compliant, Green
ACPM-7382-BLK	AVAGO	获取价格	1920MHz - 1980MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER, 4 X 4 MM, GREEN PACKAGE

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