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ACPM-7311-BLKR PDF预览

ACPM-7311-BLKR

更新时间: 2024-01-26 04:44:13
品牌 Logo 应用领域
安华高科 - AVAGO 放大器射频微波功率放大器
页数 文件大小 规格书
16页 630K
描述
824MHz - 849MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER, 4 X 4 MM, 1.10 MM HEIGHT, ROHS COMPLIANT, PLASTIC, 10 PIN

ACPM-7311-BLKR 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SOLCC10,.16,32Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.33.00.01
风险等级:5.83特性阻抗:50 Ω
构造:COMPONENT增益:11.5 dB
最大输入功率 (CW):10 dBmJESD-609代码:e4
安装特点:SURFACE MOUNT功能数量:1
端子数量:10最大工作频率:849 MHz
最小工作频率:824 MHz最高工作温度:90 °C
最低工作温度:-20 °C封装主体材料:PLASTIC/EPOXY
封装等效代码:SOLCC10,.16,32电源:3.4 V
射频/微波设备类型:NARROW BAND LOW POWER子类别:RF/Microwave Amplifiers
最大压摆率:525 mA表面贴装:YES
端子面层:Gold (Au)最大电压驻波比:10
Base Number Matches:1

ACPM-7311-BLKR 数据手册

 浏览型号ACPM-7311-BLKR的Datasheet PDF文件第6页浏览型号ACPM-7311-BLKR的Datasheet PDF文件第7页浏览型号ACPM-7311-BLKR的Datasheet PDF文件第8页浏览型号ACPM-7311-BLKR的Datasheet PDF文件第10页浏览型号ACPM-7311-BLKR的Datasheet PDF文件第11页浏览型号ACPM-7311-BLKR的Datasheet PDF文件第12页 
PCB Design Guidelines  
Stencil Design Guidelines  
The recommended ACPM-7311 PCB land pattern is shown A properly designed solder screen or stencil is required  
in Figure 15 and Figure 16. The substrate is coated with to ensure optimum amount of solder paste is deposited  
solder mask between the I/O and conductive paddle to onto the PCB pads. The recommended stencil layout is  
protect the gold pads from short circuit that is caused by shown in Figure 17. Reducing the stencil opening can po-  
solder bleeding/bridging.  
tentially generate more voids. On the other hand, stencil  
openings larger than 100% will lead to excessive solder  
paste smear or bridging across the I/O pads or conduc-  
tive paddle to adjacent I/O pads. Considering the fact  
that solder paste thickness will directly affect the quality  
of the solder joint, a good choice is to use laser cut stencil  
composed of 0.10mm(4mils)or 0.127mm(5mils) thick  
stainless steel which is capable of producing the required  
fine stencil outline.  
0.1  
0.6  
0.4  
0.6  
0.5  
0.4  
0.85  
1.6  
0.25  
0.5  
Ø 0.3mm  
on 0.6mm pitch  
Figure 15. Metallization  
0.85  
0.7  
0.55  
2.0  
0.5  
Figure 17. Solder Paste Stencil Aperture  
1.8  
0.85  
2.4  
Figure 16. Solder Mask Opening  
9

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