Datasheet > AAT3340IWP-1-T1

AAT3340IWP-1-T1

更新时间： 2024-01-06 23:26:10

品牌	Logo	应用领域
ANALOGICTECH		泵
页数	文件大小	规格书
14页	990K
描述
High Efficiency 1x/1.5x Charge Pump

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技术参数
数据手册

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AAT3340IWP-1-T1 技术参数

生命周期：	Active	包装说明：	,
Reach Compliance Code：	unknown	ECCN代码：	EAR99
HTS代码：	8542.39.00.01	风险等级：	5.71
接口集成电路类型：	LED DISPLAY DRIVER	Base Number Matches：	1

AAT3340IWP-1-T1 数据手册

PRODUCT DATASHEET

AAT3340

ChargePump

High Efficiency 1x/1.5x Charge Pump

Capacitor area is another contributor to ESR. Capacitors

that are physically large will have a lower ESR when

compared to an equivalent material smaller capacitor.

These larger devices can improve circuit transient

response when compared to an equal value capacitor in

a smaller package size.

Equivalent Series Resistance

ESR is an important characteristic to consider when

selecting a capacitor. ESR is a resistance internal to a

capacitor that is caused by the leads, internal connec-

tions, size or area, material composition, and ambient

temperature. Capacitor ESR is typically measured in mil-

liohms for ceramic capacitors and can range to more

than several ohms for tantalum or aluminum electrolytic

capacitors.

Thermal Protection

The AAT3340 has a built-in thermal protection circuit

that will shut down the charge pump if the die tempera-

ture rises above the thermal limit, as is generally the

case during short-circuit event of the V_OUTpin.

Ceramic Capacitor Materials

Ceramic capacitors less than 0.1μF are typically made

from NPO or C0G materials. NPO and C0G materials

have tight tolerance and are stable over temperature.

Capacitors with large values are typically composed of

X7R, X5R, Z5U, or Y5V dielectric materials.

Evaluation Board Layout

When designing a PCB for the AAT3340, the key require-

ments are:

Large ceramic capacitors, greater than 2.2μF, are often

available in low-cost Y5V and Z5U dielectrics, but capac-

itors greater than 1μF are usually not required for

AAT3340 applications.

1. Place the two flying capacitors, C1 and C2, as close

to the chip as possible, otherwise the 1.5X mode

performance will be compromised.

2. Place the input and output decoupling capacitors as

close to the chip as possible to reduce switching

noise and output ripple.

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3340.2008.04.1.0

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