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AAT3222IGV-2.4-T1 PDF预览

AAT3222IGV-2.4-T1

更新时间: 2024-01-01 06:55:55
品牌 Logo 应用领域
AAT 稳压器光电二极管
页数 文件大小 规格书
18页 190K
描述
150mA NanoPower⑩ LDO Linear Regulator

AAT3222IGV-2.4-T1 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:TSOP, TSOP5/6,.11,37Reach Compliance Code:unknown
风险等级:5.84Is Samacsys:N
可调性:FIXED标称回动电压 1:0.22 V
最大绝对输入电压:7 VJESD-30 代码:R-PDSO-G5
最大电网调整率:0.0144%最大负载调整率:0.0336%
湿度敏感等级:3输出次数:1
端子数量:5最高工作温度:85 °C
最低工作温度:-40 °C最大输出电流 1:0.1 A
标称输出电压 1:2.4 V封装主体材料:PLASTIC/EPOXY
封装代码:TSOP封装等效代码:TSOP5/6,.11,37
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
包装方法:TAPE AND REEL认证状态:Not Qualified
子类别:Other Regulators表面贴装:YES
技术:CMOS端子形式:GULL WING
端子节距:0.95 mm端子位置:DUAL
最大电压容差:2%Base Number Matches:1

AAT3222IGV-2.4-T1 数据手册

 浏览型号AAT3222IGV-2.4-T1的Datasheet PDF文件第11页浏览型号AAT3222IGV-2.4-T1的Datasheet PDF文件第12页浏览型号AAT3222IGV-2.4-T1的Datasheet PDF文件第13页浏览型号AAT3222IGV-2.4-T1的Datasheet PDF文件第15页浏览型号AAT3222IGV-2.4-T1的Datasheet PDF文件第16页浏览型号AAT3222IGV-2.4-T1的Datasheet PDF文件第17页 
AAT3221/2  
150mA NanoPower™ LDO Linear Regulator  
The power dissipation for a 100mA load occurring  
Printed Circuit Board Layout  
Recommendations  
for 91.8% of the duty cycle will be 229.5mW. Now  
the power dissipation for the remaining 8.2% of the  
duty cycle at the 150mA load can be calculated:  
In order to obtain the maximum performance from  
the AAT3221/2 LDO regulator, very careful attention  
must be considered in regard to the printed circuit  
board layout. If grounding connections are not prop-  
erly made, power supply ripple rejection and LDO  
regulator transient response can be compromised.  
PD(MAX) = (VIN - VOUT)IOUT + (VIN x IGND  
)
PD(150mA) = (5.0V - 2.5V)150mA + (5.0V x 1.1mA)  
PD(150mA) = 375mW  
PD(8.2%D/C) = %DC x PD(150mA)  
PD(8.2%D/C) = 0.082 x 375mW  
PD(8.2%D/C) = 30.75mW  
The LDO regulator external capacitors CIN and  
COUT should be connected as directly as possible  
to the ground pin of the LDO regulator. For maxi-  
mum performance with the AAT3221/2, the ground  
pin connection should then be made directly back  
to the ground or common of the source power sup-  
ply. If a direct ground return path is not possible  
due to printed circuit board layout limitations, the  
LDO ground pin should then be connected to the  
common ground plane in the application layout.  
The power dissipation for a 150mA load occurring  
for 8.2% of the duty cycle will be 20.9mW. Finally,  
the two power dissipation levels can summed to  
determine the total true power dissipation under the  
varied load:  
PD(total) = PD(100mA) + PD(150mA)  
PD(total) = 229.5mW + 30.75mW  
PD(total) = 260.25mW  
The maximum power dissipation for the AAT3221/2  
operating at an ambient temperature of 85°C is  
267mW. The device in this example will have a total  
power dissipation of 260.25mW. This is within the  
thermal limits for safe operation of the device.  
14  
3221.2005.12.1.11  

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