Datasheet > AAP803

AAP803

更新时间： 2023-12-06 20:02:46

品牌	Logo	应用领域
美国微芯 - MICROCHIP		/
页数	文件大小	规格书
7页	356K
描述
The AAP803AX ECM microphone preamplifier is a chip-scale device developed specifically for integra

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AAP803 数据手册

Electret condenser Microphone Pre- Amplifer

Package Outline Dimensions

The package is halogen free and meets RoHS2 and REACH standards.

MILLIMETERS

INCHES

MIN

MAX

MIN

MAX

Dim

0.075 0.105 0.0030 0.0041

0.200 0.250 0.0079 0.0098

Ø b

0.120

0.0047

0.330 BSC

0.0130 BSC

0.530 0.570 0.0209 0.0224

0.300 BSC

0.600 BSC

0.0118 BSC

0.0236 BSC

0.800 0.840 0.0315 0.0331

Note:

1. Solder ball composition is SnAgCu.

2. Dimensions are in mm, inches for

reference only.

Figure 3 · 6 Bump X2CSP Micro SMD Package Dimensions

Tape (Pocket) Pitch

Ø0.140mm

Solder Mask Opening

Carrier

Tape

Ø0.080mm

Cu Pad

0.600mm

Feed Direction

0.300mm



Carrier tape width 8mm

Reel Diameter 7”

Devices per reel 3,500

0.330mm

Figure 4 · PCB Layout Footprint / Tape and Reel Information

1...3 4 567

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