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A48P3616AV-4UF PDF预览

A48P3616AV-4UF

更新时间: 2024-02-29 17:20:17
品牌 Logo 应用领域
联笙电子 - AMICC 动态存储器
页数 文件大小 规格书
66页 1492K
描述
DRAM

A48P3616AV-4UF 技术参数

生命周期:Contact Manufacturer包装说明:,
Reach Compliance Code:unknown风险等级:5.7
Base Number Matches:1

A48P3616AV-4UF 数据手册

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A48P3616A  
Pin Descriptions  
Symbol  
Type  
Description  
Clock: CK and CK are differential clock inputs. All address and control input signals  
are sampled on the crossing of the positive edge of CK and negative edge of CK.  
Input  
CK, CK  
CK  
Output (read) data is referenced to the crossings of CK and  
crossing).  
(both directions of  
Clock Enable: CKE HIGH activates, and CKE Low deactivates, internal clock  
signals and device input buffers and output drivers. Taking CKE Low provides  
Precharge Power Down and Self Refresh operation (all banks idle), or Active Power  
Down (row Active in any bank). CKE is synchronous for power down entry and exit,  
and for self refresh entry. CKE is asynchronous for self refresh exit. CKE must be  
maintained high throughout read and write accesses. Input buffers, excluding CK,  
CKE  
Input  
CK  
and CKE are disabled during Power Down. Input buffers, excluding CKE, are  
disabled during self refresh.  
Chip Select: All commands are masked when CS is registered high. CS provides  
Input  
Input  
CS  
for external bank selection on systems with multiple banks. CS is considered part of  
the command code.  
Command Inputs: RAS , CAS , WE (along with CS ) define the command being  
entered.  
RAS , CAS , WE  
Input Data Mask: DM is an input mask signal for write data. Input data is masked  
when DM is sampled high coincident with that input data during a Write access. DM  
is sampled on both edges of DQS. Although DM pins are input only, the DM loading  
matches the DQ and DQS loading. During a Read, DM can be driven high, low, or  
floated. LDM corresponds to the data on DQ0-DQ7; UDM corresponds to the data on  
DQ8-DQ15.  
UDM, LDM  
BA0, BA1  
Input  
Input  
Bank Address Inputs: BA0 and BA1 define to which bank an Active, Read, Write or  
Precharge command is being applied. BA0 and BA1 also determines if the mode  
register or extended mode register is to be accessed during a MRS or EMRS cycle.  
Address Inputs: Provide the row address for Active commands, and the column  
address and Auto Precharge bit for Read/Write commands, to select one location  
out of the memory array in the respective bank. A10 is sampled during a Precharge  
command to determine whether the Precharge applies to one bank (A10 low) or all  
banks (A10 high). If only one bank is to be precharged, the bank is selected by BA0,  
BA1. The address inputs also provide the op-code during a Mode Register Set  
command.  
A0-A11  
Input  
DQ  
Input / Output Data Input/Output: Data bus.  
Data Strobe: Output with read data, input with write data. Edge-aligned with read  
LDQS, UDQS  
Input / Output data, centered in write data. Used to capture write data. LDQS corresponds to the  
data on DQ0-DQ7; UDQS corresponds to the data on DQ8-DQ15  
NC  
No Connect: No internal electrical connection is present.  
DQ Power Supply: 2.5V ± 0.2V.  
DQ Ground  
VDDQ  
VSSQ  
VDD  
Supply  
Supply  
Supply  
Supply  
Supply  
Power Supply: 2.5V ± 0.2V.  
Ground  
VSS  
SSTL_2 reference voltage: (VDDQ / 2) ± 1%.  
VREF  
PRELIMINARY (July, 2010, Version 0.0)  
4
AMIC Technology, Corp.  

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