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A3967SLB-TTR PDF预览

A3967SLB-TTR

更新时间： 2024-02-19 23:23:08
品牌 Logo 应用领域
急速微 - ALLEGRO 驱动器转换器
页数 文件大小 规格书
16页 510K
描述
Stepper Motor Controller, 0.85A, PDSO24, LEAD FREE, SOIC-24

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A3967SLB-TTR 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：SOIC
包装说明：SOP, SOP24,.4针数：24
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.36
模拟集成电路 - 其他类型：STEPPER MOTOR CONTROLLERJESD-30 代码：R-PDSO-G24
JESD-609代码：e3长度：15.4 mm
功能数量：1端子数量：24
最高工作温度：85 °C最低工作温度：-20 °C
最大输出电流：0.85 A封装主体材料：PLASTIC/EPOXY
封装代码：SOP封装等效代码：SOP24,.4
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：NOT SPECIFIED电源：3.3/5 V
认证状态：Not Qualified座面最大高度：2.65 mm
子类别：Motion Control Electronics最大供电电流 (Isup)：65 mA
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：3 V
标称供电电压 (Vsup)：5 V表面贴装：YES
温度等级：OTHER端子面层：Matte Tin (Sn)
端子形式：GULL WING端子节距：1.27 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：7.5 mmBase Number Matches：1

A3967SLB-TTR 数据手册

 浏览型号A3967SLB-TTR的Datasheet PDF文件第5页浏览型号A3967SLB-TTR的Datasheet PDF文件第6页浏览型号A3967SLB-TTR的Datasheet PDF文件第7页浏览型号A3967SLB-TTR的Datasheet PDF文件第9页浏览型号A3967SLB-TTR的Datasheet PDF文件第10页浏览型号A3967SLB-TTR的Datasheet PDF文件第11页 
3967  
MICROSTEPPING DRIVER  
WITH TRANSLATOR  
Applications Information  
Layout. The printed wiring board should use a heavy  
ground plane.  
Current Sensing. To minimize inaccuracies caused by  
ground-trace IR drops in sensing the output current level,  
the current-sense resistor (RS) should have an independent  
ground return to the star ground of the device. This path  
should be as short as possible. For low-value sense  
resistors the IR drops in the printed wiring board sense  
resistor’s traces can be significant and should be taken  
into account. The use of sockets should be avoided as  
they can introduce variation in RS due to their contact  
resistance.  
For optimum electrical and thermal performance, the  
driver should be soldered directly onto the board.  
The load supply terminal, VBB, should be decoupled  
with an electrolytic capacitor (>47 µF is recommended)  
placed as close to the device as possible.  
To avoid problems due to capacitive coupling of the  
high dv/dt switching transients, route the bridge-output  
traces away from the sensitive logic-input traces. Always  
drive the logic inputs with a low source impedance to  
increase noise immunity.  
Allegro MicroSystems recommends a value of RS  
given by  
RS = 0.5/ITRIPmax  
Grounding. A star ground system located close to the  
driver is recommended.  
Thermal protection. Circuitry turns off all drivers  
when the junction temperature reaches 165°C, typically.  
It is intended only to protect the device from failures due  
to excessive junction temperatures and should not imply  
that output short circuits are permitted. Thermal shut-  
down has a hysteresis of approximately 15°C.  
The 24-lead SOIC has the analog ground and the  
power ground internally bonded to the power tabs of the  
package (leads 6, 7, 18, and 19).  
*RθJA = 35°C/W on JEDEC standard  
“High-K” four-layer board per JESD 51-7.  
†RθJA = 50°C/W on typical two-sided PCB with  
1.3 square inches copper ground on each side.  
See also, Application Note 29501.5,  
Improving Batwing Power Dissipation.  
115 Northeast Cutoff, Box 15036  
Worcester, Massachusetts 01615-0036 (508) 853-5000  
8
1...567891011...16

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