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A2F060M3G-FG256YI PDF预览

A2F060M3G-FG256YI

更新时间: 2024-01-03 16:33:52
品牌 Logo 应用领域
ACTEL 可编程逻辑
页数 文件大小 规格书
170页 5851K
描述
Field Programmable Gate Array, 1536 CLBs, 60000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-256

A2F060M3G-FG256YI 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:LBGA,Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.83
Is Samacsys:NJESD-30 代码:S-PBGA-B256
JESD-609代码:e0长度:17 mm
湿度敏感等级:3可配置逻辑块数量:1536
等效关口数量:60000端子数量:256
组织:1536 CLBS, 60000 GATES封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE峰值回流温度(摄氏度):225
可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY座面最大高度:1.7 mm
最大供电电压:1.575 V最小供电电压:1.425 V
标称供电电压:1.5 V表面贴装:YES
技术:CMOS端子面层:TIN LEAD
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:20
宽度:17 mmBase Number Matches:1

A2F060M3G-FG256YI 数据手册

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1 – SmartFusion Device Family Overview  
Introduction  
The Actel SmartFusion™ family of intelligent mixed signal FPGAs builds on the technology first  
introduced with the Fusion mixed signal FPGAs. SmartFusion devices are made possible by integrating  
FPGA technology with programmable high-performance analog and hardened ARM® Cortex™-M3  
microcontroller blocks on a flash semiconductor process. The SmartFusion family takes its name from  
the fact that these three discrete technologies are integrated on a single chip, enabling the lowest cost of  
ownership and smallest footprint solution to you.  
General Description  
Microcontroller Subsystem (MSS)  
The MSS is composed of a 100 MHz Cortex-M3 processor and integrated peripherals, which are  
interconnected via a multi-layer AHB bus matrix (ABM). This matrix allows the Cortex-M3 processor,  
FPGA fabric master, Ethernet message authentication controller (MAC), when available, and peripheral  
DMA (PDMA) controller to act as masters to the integrated peripherals, FPGA fabric, embedded  
nonvolatile memory (eNVM), embedded synchronous RAM (eSRAM), external memory controller  
(EMC), and analog compute engine (ACE) blocks.  
SmartFusion devices of different densities offer various sets of integrated peripherals. Available  
peripherals include SPI, I2C, and UART serial ports, embedded FlashROM (EFROM), 10/100 Ethernet  
MAC, timers, phase-locked loops (PLLs), oscillators, real-time counters (RTC), and peripheral DMA  
controller (PDMA).  
Programmable Analog  
Analog Front-End (AFE)  
SmartFusion devices offer an enhanced analog front-end compared to Fusion devices. The successive  
approximation register analog-to-digital converters (SAR ADC) are similar to those found on Fusion  
devices. SmartFusion also adds first order sigma-delta digital-to-analog converters (SDD DAC).  
SmartFusion can handle multiple analog signals simultaneously with its signal conditioning blocks  
(SCBs). SCBs are made of a combination of active bipolar prescalers (ABPS), comparators, current  
monitors and temperature monitors. ABPS modules allow larger bipolar voltages to be fed to the ADC.  
Current monitors take the voltage across an external sense resistor and convert it to a voltage suitable  
for the ADC input range. Similarly, the temperature monitor reads the current through an external PN-  
junction (diode or transistor) and converts it internally for the ADC. The SCB also includes comparators  
to monitor fast signal thresholds without using the ADC. The output of the comparators can be fed to the  
analog compute engine or the ADC.  
Analog Compute Engine (ACE)  
The mixed signal blocks found in SmartFusion are controlled and connected to the rest of the system via  
a dedicated processor called the analog compute engine (ACE). The role of the ACE is to offload control  
of the analog blocks from the Cortex-M3, thus offering faster throughput or better power consumption  
compared to a system where the main processor is in charge of monitoring the analog resources. The  
ACE is built to handle sampling, sequencing, and post-processing of the ADCs, DACs, and SCBs.  
Revision 4  
1-1  

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