Datasheet > A19350LUBATN-FBM-A

A19350LUBATN-FBM-A

更新时间： 2025-08-08 02:47:47

品牌	Logo	应用领域
急速微 - ALLEGRO		/
页数	文件大小	规格书
14页	1188K
描述
High Accuracy GMR Wheel Speed and Direction Sensor IC

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A19350

High Accuracy GMR Wheel Speed and Direction Sensor IC

FEATURES AND BENEFITS

DESCRIPTION

• GMR technology integrates high sensitivity MR

(magnetoresistive) sensor elements and high precision

BiCMOS circuits on a single silicon integrated circuit,

offering high accuracy, low magnetic field operation

• Integrated capacitor in a single overmolded miniature

package provides greater EMC robustness

• SolidSpeed Digital Architecture™ supports advanced

algorithms, maintaining performance in the presence of

extreme system-level disturbances, including vibration

immunity capability over the full target pitch

• Flexible orientation for xMR or Hall replacement

• ASIL B rating based on integrated diagnostics and

certified safety design process

The A19350 is a giant magnetoresistance (GMR) integrated

circuit (IC) that provides a user-friendly two-wire solution for

applicationswherespeedanddirectioninformationisrequired.

The small integrated package includes an integrated capacitor

and GMR IC in a single overmold design with an additional

molded lead-stabilizing bar for robust shipping and ease of

assembly.

The GMR-based IC is designed for use in conjunction with

front-biased ring magnet encoders. State-of-the-art GMR

technologywithindustry-leadingsignalprocessingalgorithms

accuratelyswitchinresponsetolow-leveldifferentialmagnetic

signals.ThehighsensitivityofGMRcombinedwithdifferential

sensing offers inherent rejection of interfering common-mode

magnetic fields and valid speed and direction over larger air

gaps, commonly required in wheel speed sensing applications.

• Two-wire current source output pulse-width protocol

supporting speed, direction, and ASIL

• EEPROM offers device traceability throughout the

production process

Patented GMR technology allows the same orientation as

Hall-effect for a drop-in solution in the application.

Integrated diagnostics are used to detect an IC failure which

impacts the output protocol’s accuracy, providing coverage

compatiblewithASILBcompliance.Built-inEEPROMscratch

memory offers traceability of the device throughout the IC’s

production process.

PACKAGE:

2-Pin SIP

The IC is offered in the UB package, which integrates the IC

and a high-temperature ceramic capacitor in a single overmold

SIP package for enhanced EMC performance. The 2-pin SIP

package is lead (Pb) free, with tin leadframe plating.

(suffix UB)

Not to scale

VCC

ADC

Output

–

Current

Generator

ESD

Analog-to-Digital

Front End

Amplification

Digital

Controller

GMR

Elements

and

Signal Conditioning

–

ADC

GND

EEPROM

Oscillator

Diagnostics

Regulator

Figure 1: Functional Block Diagram

A19350-DS

November 16, 2018

MCO-0000526

12 3 4 5 6 7...14

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