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A1460 PDF预览

A1460

更新时间: 2022-05-06 10:10:10
品牌 Logo 应用领域
ACTEL 布线
页数 文件大小 规格书
98页 2009K
描述
Highly Predictable Performance with 100% Automatic Placement and Routing

A1460 数据手册

 浏览型号A1460的Datasheet PDF文件第6页浏览型号A1460的Datasheet PDF文件第7页浏览型号A1460的Datasheet PDF文件第8页浏览型号A1460的Datasheet PDF文件第10页浏览型号A1460的Datasheet PDF文件第11页浏览型号A1460的Datasheet PDF文件第12页 
HiRel FPGAs  
Actel Extended Flow1  
Require-  
ment  
Step Screen  
Method  
1.  
Wafer Lot Acceptance2  
Destructive In-Line Bond Pull3  
Internal Visual  
5007 with Step Coverage Waiver  
2011, Condition D  
All Lots  
Sample  
100%  
100%  
100%  
100%  
100%  
100%  
100%  
100%  
100%  
100%  
100%  
All Lots  
2.  
3.  
2010, Condition A  
4.  
Serialization  
5.  
Temperature Cycling  
Constant Acceleration  
Particle Impact Noise Detection  
Radiographic  
1010, Condition C  
6.  
2001, Condition D or E, Y1 Orientation Only  
2020, Condition A  
7.  
8.  
2012 (one view only)  
9.  
Pre-Burn-In Test  
In accordance with applicable Actel device specification  
1015, Condition D, 240 hours @ 125°C minimum  
10.  
11.  
12.  
13.  
Burn-in Test  
Interim (Post-Burn-In) Electrical Parameters In accordance with applicable Actel device specification  
Reverse Bias Burn-In 1015, Condition C, 72 hours @ 150°C minimum  
Interim (Post-Burn-In) Electrical Parameters In accordance with applicable Actel device specification  
Percent Defective Allowable (PDA)  
Calculation  
5%, 3% Functional Parameters @ 25°C  
14.  
15.  
Final Electrical Test  
In accordance with Actel applicable device specification  
which includes a, b, and c:  
100%  
100%  
a. Static Tests  
(1) 25°C  
5005  
5005  
(Subgroup 1, Table1)  
(2) –55°C and +125°C  
(Subgroups 2, 3, Table 1)  
b. Functional Tests  
100%  
(1) 25°C  
5005  
5005  
(Subgroup 7, Table 15)  
(2) –55°C and +125°C  
(Subgroups 8A and B, Table 1)  
c. Switching Tests at 25°C  
(Subgroup 9, Table 1)  
100%  
100%  
5005  
1014  
16.  
Seal  
a. Fine  
b. Gross  
17.  
External Visual  
2009  
100%  
Notes:  
1. Actel offers the extended flow for customers who require additional screening beyond the requirements of the MIL-STD-833, Class B. Actel is  
compliant to the requirements of MIL-STD-883, Paragraph 1.2.1, and MIL-I-38535, Appendix A. Actel is offering this extended flow  
incorporating the majority of the screening procedures as outlined in Method 5004 of MIL-STD-883, Class S. The exceptions to Method 5004  
are shown in notes 2 and 3 below.  
2. Wafer lot acceptance is performed to Method 5007; however, the step coverage requirement as specified in Method 2018 must be waived.  
3. MIL-STD-883, Method 5004 requires 100 percent Radiation latch-up testing (Method 1020). Actel will not be performing any radiation testing,  
and this requirement must be waived in its entirety.  
9

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