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A1321ELHLT-T PDF预览

A1321ELHLT-T

更新时间: 2024-01-28 07:33:17
品牌 Logo 应用领域
急速微 - ALLEGRO 传感器
页数 文件大小 规格书
11页 319K
描述
Ratiometric Linear Hall Effect Sensor for High-Temperature Operation

A1321ELHLT-T 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
Reach Compliance Code:compliant风险等级:5.89
主体宽度:1.55 mm主体高度:3.03 mm
主体长度或直径:4.1 mm外壳:PLASTIC
JESD-609代码:e0线性度 (%):1 %
最大磁场范围:10 mT安装特点:THROUGH HOLE MOUNT
最大工作电流:8 mA最大输出电流:-1.5 mA
输出范围:0.20-4.70V输出类型:ANALOG VOLTAGE
封装形状/形式:RECTANGULAR电阻:1.5 Ω
灵敏度(mV / G):5 mV/G传感器/换能器类型:MAGNETIC FIELD SENSOR,HALL EFFECT
表面贴装:NO端子面层:Tin/Lead (Sn/Pb)
端接类型:SOLDERBase Number Matches:1

A1321ELHLT-T 数据手册

 浏览型号A1321ELHLT-T的Datasheet PDF文件第5页浏览型号A1321ELHLT-T的Datasheet PDF文件第6页浏览型号A1321ELHLT-T的Datasheet PDF文件第7页浏览型号A1321ELHLT-T的Datasheet PDF文件第8页浏览型号A1321ELHLT-T的Datasheet PDF文件第10页浏览型号A1321ELHLT-T的Datasheet PDF文件第11页 
A1321, A1322,  
and A1323  
Ratiometric Linear Hall Effect Sensor  
for High-Temperature Operation  
Power Derating  
Example: Reliability for VCC at TA=150°C, package UA, using  
minimum-K PCB.  
The device must be operated below the maximum junction  
temperature of the device, TJ(max). Under certain combinations of  
peak conditions, reliable operation may require derating sup-  
plied power or improving the heat dissipation properties of the  
application. This section presents a procedure for correlating  
factors affecting operating TJ. (Thermal data is also available on  
the Allegro MicroSystems Web site.)  
Observe the worst-case ratings for the device, specically:  
RθJA=165°C/W, TJ(max) =165°C, VCC(max)= 5.5 V, and  
ICC(max) = 8 mA.  
Calculate the maximum allowable power level, PD(max). First,  
invert equation 3:  
The Package Thermal Resistance, RθJA, is a gure of merit sum-  
marizing the ability of the application and the device to dissipate  
heat from the junction (die), through all paths to the ambient air.  
Its primary component is the Effective Thermal Conductivity,  
K, of the printed circuit board, including adjacent devices and  
traces. Radiation from the die through the device case, RθJC, is  
relatively small component of RθJA. Ambient air temperature,  
TA, and air motion are signicant external factors, damped by  
overmolding.  
ΔTmax = TJ(max) – TA = 165°C150°C = 15°C  
This provides the allowable increase to TJ resulting from internal  
power dissipation. Then, invert equation 2:  
PD(max) = ΔTmax ÷RθJA =1C÷165 °C/W=91mW  
Finally, invert equation 1 with respect to voltage:  
VCC(est) = PD(max) ÷ ICC(max) = 91mW÷8mA=11.4 V  
The effect of varying power levels (Power Dissipation, PD), can  
be estimated. The following formulas represent the fundamental  
relationships used to estimate TJ, at PD.  
The result indicates that, at TA, the application and device can  
dissipate adequate amounts of heat at voltages VCC(est)  
.
Compare VCC(est) to VCC(max). If VCC(est) VCC(max), then reli-  
able operation between VCC(est) and VCC(max) requires enhanced  
RθJA. If VCC(est) VCC(max), then operation between VCC(est) and  
VCC(max) is reliable under these conditions.  
PD = VIN  
I
(1)  
×
IN  
ΔT = PD  
R
(2)  
θJA  
×
TJ = TA + ΔT  
(3)  
For example, given common conditions such as: TA= 25°C,  
VCC = 12 V, ICC = 4 mA, and RθJA = 140 °C/W, then:  
PD = VCC  
I
= 12 V 4 mA = 48 mW  
×
×
CC  
ΔT = PD  
R
= 48 mW 140 °C/W = 7°C  
×
×
θJA  
TJ = TA + ΔT = 25°C + 7°C = 32°C  
A worst-case estimate, PD(max), represents the maximum allow-  
able power level (VCC(max), ICC(max)), without exceeding TJ(max)  
at a selected RθJA and TA.  
,
Allegro MicroSystems, Inc.  
115 Northeast Cutoff, Box 15036  
9
Worcester, Massachusetts 01615-0036 (508) 853-5000  
www.allegromicro.com  

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