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A1242EUA-I2-T PDF预览

A1242EUA-I2-T

更新时间: 2024-02-09 01:36:09
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急速微 - ALLEGRO /
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11页 364K
描述
Two-Wire Chopper-Stabilized Hall Effect Latch

A1242EUA-I2-T 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:LEAD FREE, ULTRA MINI, SIP-3Reach Compliance Code:unknown
风险等级:5.83其他特性:BICMOS COMPATIBLE, REVERSE BATTERY PROTECTION
主体宽度:1.52 mm主体高度:5.2 mm
主体长度或直径:4.105 mm滞后:6.4 mT
输入模式:UNIPOLARJESD-609代码:e3
最大磁场范围:8 mT最小磁场范围:-8 mT
安装特点:THROUGH HOLE MOUNT端子数量:3
最大工作电流:5 mA最高工作温度:85 °C
最低工作温度:-40 °C输出接口类型:2-WIRE INTERFACE
输出类型:ANALOG CURRENT封装主体材料:PLASTIC/EPOXY
封装等效代码:SIP3,.03封装形状/形式:RECTANGULAR
电源:3.5/24 V传感器/换能器类型:MAGNETIC FIELD SENSOR,HALL EFFECT
子类别:Other Sensors最大供电电压:24 V
最小供电电压:3.5 V表面贴装:NO
技术:BICMOS端子面层:Matte Tin (Sn)
端接类型:SOLDERBase Number Matches:1

A1242EUA-I2-T 数据手册

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A1242  
Two-Wire Chopper-Stabilized Hall Effect Latch  
Power Derating  
Power Derating  
Example: Reliability for VCC at TA=150°C, package LH, using  
minimum-K PCB.  
The device must be operated below the maximum junction  
temperature of the device, TJ(max). Under certain combinations of  
peak conditions, reliable operation may require derating sup-  
plied power or improving the heat dissipation properties of the  
application. This section presents a procedure for correlating  
factors affecting operating TJ. (Thermal data is also available on  
the Allegro MicroSystems Web site.)  
Observe the worst-case ratings for the device, specifically:  
RθJA=228°C/W, TJ(max) =165°C, VCC(max)= 24 V, and  
ICC(max) = 17 mA.  
Calculate the maximum allowable power level, PD(max). First,  
invert equation 3:  
The Package Thermal Resistance, RθJA, is a figure of merit sum-  
marizing the ability of the application and the device to dissipate  
heat from the junction (die), through all paths to the ambient air.  
Its primary component is the Effective Thermal Conductivity,  
K, of the printed circuit board, including adjacent devices and  
traces. Radiation from the die through the device case, RθJC, is  
relatively small component of RθJA. Ambient air temperature,  
TA, and air motion are significant external factors, damped by  
overmolding.  
ΔTmax = TJ(max) – TA = 165°C150°C = 15°C  
This provides the allowable increase to TJ resulting from internal  
power dissipation. Then, invert equation 2:  
PD(max) = ΔTmax ÷RθJA =1C÷228 °C/W=66mW  
Finally, invert equation 1 with respect to voltage:  
VCC(est) = PD(max) ÷ ICC(max) = 66mW÷17mA=3.9 V  
The effect of varying power levels (Power Dissipation, PD), can  
be estimated. The following formulas represent the fundamental  
relationships used to estimate TJ, at PD.  
The result indicates that, at TA, the application and device can  
dissipate adequate amounts of heat at voltages VCC(est)  
.
Compare VCC(est) to VCC(max). If VCC(est) VCC(max), then reli-  
able operation between VCC(est) and VCC(max) requires enhanced  
RθJA. If VCC(est) VCC(max), then operation between VCC(est) and  
VCC(max) is reliable under these conditions.  
PD = VIN  
I
(1)  
(2)  
(3)  
×
IN  
ΔT = PD  
R
θJA  
×
TJ = TA + ΔT  
For example, given common conditions such as: TA= 25°C,  
VCC = 12 V, ICC = 6 mA, and RθJA = 165 °C/W, then:  
PD = VCC  
I
= 12 V 6 mA = 72 mW  
×
×
CC  
ΔT = PD  
R
= 72 mW 165 °C/W = 12°C  
×
×
θJA  
TJ = TA + ΔT = 25°C + 12°C = 37°C  
A worst-case estimate, PD(max), represents the maximum allow-  
able power level (VCC(max), ICC(max)), without exceeding TJ(max)  
at a selected RθJA and TA.  
,
Allegro MicroSystems, Inc.  
9
115 Northeast Cutoff, Box 15036  
A1242-DS  
Worcester, Massachusetts 01615-0036 (508) 853-5000  
www.allegromicro.com  

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