Datasheet > A1106LLTTR-T

A1106LLTTR-T

更新时间： 2024-01-20 05:41:09

品牌	Logo	应用领域
急速微 - ALLEGRO		信息通信管理
页数	文件大小	规格书
13页	635K
描述
Analog Circuit, 1 Func, BICMOS, PSSO3, SOT-89, 3 PIN

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技术参数
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A1106LLTTR-T 技术参数

是否Rohs认证：	符合	生命周期：	Active
包装说明：	,	Reach Compliance Code：	compliant
HTS代码：	8542.39.00.01	风险等级：	5.57
模拟集成电路 - 其他类型：	ANALOG CIRCUIT	JESD-30 代码：	R-PSSO-F3
功能数量：	1	端子数量：	3
最高工作温度：	150 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, HEAT SINK/SLUG	峰值回流温度（摄氏度）：	NOT SPECIFIED
最大供电电压 (Vsup)：	24 V	最小供电电压 (Vsup)：	3.8 V
表面贴装：	YES	技术：	BICMOS
温度等级：	AUTOMOTIVE	端子形式：	FLAT
端子位置：	SINGLE	处于峰值回流温度下的最长时间：	NOT SPECIFIED
Base Number Matches：	1

A1106LLTTR-T 数据手册

A1101, A1102, A1103,

A1104, and A1106

Continuous-Time Switch Family

POWER DERATING

A worst-case estimate, P_D(max), represents the maximum allow-

able power level (V_CC(max), I_CC(max)), without exceeding T_J(max)

at a selected R_θJAand T_A.

Power Derating

The device must be operated below the maximum junction

temperature of the device, T_J(max). Under certain combinations of

peak conditions, reliable operation may require derating supplied

power or improving the heat dissipation properties of the appli-

cation. This section presents a procedure for correlating factors

affecting operating T_J. (Thermal data is also available on the

Allegro MicroSystems Web site.)

Example: Reliability for V_CCat T_A=150°C, package UA, using

minimum-K PCB.

Observe the worst-case ratings for the device, specifically:

R_θJA=165°C/W, T_J(max)=165°C, V_CC(max)= 24 V, and

I_CC(max)= 7.5 mA.

The Package Thermal Resistance, R_θJA, is a figure of merit sum-

marizing the ability of the application and the device to dissipate

heat from the junction (die), through all paths to the ambient air.

Its primary component is the Effective Thermal Conductivity, K,

of the printed circuit board, including adjacent devices and traces.

Radiation from the die through the device case, R_θJC, is relatively

small component of R_θJA. Ambient air temperature, T_A, and air

motion are significant external factors, damped by overmolding.

Calculate the maximum allowable power level, P_D(max). First,

invert equation 3:

ΔT_max= T_J(max)– T_A= 165°C–150°C = 15°C

This provides the allowable increase to T_Jresulting from internal

power dissipation. Then, invert equation 2:

P_D(max)= ΔT_max÷R_θJA=15°C÷165 °C/W=91mW

The effect of varying power levels (Power Dissipation, P_D), can

be estimated. The following formulas represent the fundamental

relationships used to estimate T_J, at P_D.

Finally, invert equation 1 with respect to voltage:

V_CC(est)= P_D(max)÷ I_CC(max)= 91mW÷7.5mA=12.1 V

The result indicates that, at T_A, the application and device can dis-

P_D= V_IN

(1)

sipate adequate amounts of heat at voltages ≤V_CC(est)

ꢀ

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀΔT = P_D

(2)

θJA

Compare V_CC(est)to V_CC(max). If V_CC(est)≤ V_CC(max), then reli-

able operation between V_CC(est)and V_CC(max)requires enhanced

R_θJA. If V_CC(est)≥ V_CC(max), then operation between V_CC(est)and

V_CC(max)is reliable under these conditions.

T_J= T_A+ ΔT

(3)

For example, given common conditions such as: T_A= 25°C,

V_CC= 12 V, I_CC= 4 mA, and R_θJA= 140 °C/W, then:

P_D= V_CC

= 12 V 4 mA = 48 mW

ΔT = P_D

= 48 mW 140 °C/W = 7°C

θJA

T_J= T_A+ ΔT = 25°C + 7°C = 32°C

Allegro MicroSystems, LLC

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

1...6 7 8910 11 12 13

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