A1104LUA-T

更新时间： 2024-01-26 07:29:51

品牌	Logo	应用领域
急速微 - ALLEGRO		模拟IC 开关信号电路信息通信管理
页数	文件大小	规格书
11页	426K
描述
Continuous-Time Switch Family

阅读下载

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

A1104LUA-T 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	SIP
包装说明：	SIP,	针数：	3
Reach Compliance Code：	compliant	HTS代码：	8542.39.00.01
风险等级：	0.68	Is Samacsys：	N
其他特性：	REVERSE BATTERY PROTECTION	模拟集成电路 - 其他类型：	ANALOG CIRCUIT
JESD-30 代码：	R-PSIP-T3	JESD-609代码：	e3
长度：	4.09 mm	湿度敏感等级：	1
功能数量：	1	端子数量：	3
最高工作温度：	150 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	SIP
封装形状：	RECTANGULAR	封装形式：	IN-LINE
峰值回流温度（摄氏度）：	NOT SPECIFIED	认证状态：	Not Qualified
座面最大高度：	5.26 mm	最大供电电压 (Vsup)：	24 V
最小供电电压 (Vsup)：	3.8 V	标称供电电压 (Vsup)：	12 V
表面贴装：	NO	技术：	BICMOS
温度等级：	AUTOMOTIVE	端子面层：	Matte Tin (Sn)
端子形式：	THROUGH-HOLE	端子节距：	1.27 mm
端子位置：	SINGLE	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	1.52 mm	Base Number Matches：	1

A1104LUA-T 数据手册

A1101, A1102, A1103, A1104, and A1106

Continuous-Time Switch Family

Power Derating

Example: Reliability for V_CCat T_A=150°C, package UA, using

minimum-K PCB.

The device must be operated below the maximum junction

temperature of the device, T_J(max). Under certain combinations of

peak conditions, reliable operation may require derating sup-

plied power or improving the heat dissipation properties of the

application. This section presents a procedure for correlating

factors affecting operating T_J. (Thermal data is also available on

the Allegro MicroSystems Web site.)

Observe the worst-case ratings for the device, specifically:

_θJA=165°C/W, T_J(max)=165°C, V_CC(max)= 24 V, and

I_CC(max)= 7.5 mA.

Calculate the maximum allowable power level, P_D(max). First,

invert equation 3:

The Package Thermal Resistance, R_θJA, is a figure of merit sum-

marizing the ability of the application and the device to dissipate

heat from the junction (die), through all paths to the ambient air.

Its primary component is the Effective Thermal Conductivity,

K, of the printed circuit board, including adjacent devices and

traces. Radiation from the die through the device case, R_θJC, is

relatively small component of R_θJA. Ambient air temperature,

T_A, and air motion are significant external factors, damped by

overmolding.

∆T_max= T_J(max)– T_A= 165°C–150°C = 15°C

This provides the allowable increase to T_Jresulting from internal

power dissipation. Then, invert equation 2:

P_D(max)= ∆T_max÷R_θJA=15°C÷165 °C/W=91mW

Finally, invert equation 1 with respect to voltage:

V_CC(est)= P_D(max)÷ I_CC(max)= 91mW÷7.5mA=12.1 V

The effect of varying power levels (Power Dissipation, P_D), can

be estimated. The following formulas represent the fundamental

relationships used to estimate T_J, at P_D.

The result indicates that, at T_A, the application and device can

dissipate adequate amounts of heat at voltages ≤V_CC(est)

Compare V_CC(est)to V_CC(max). If V_CC(est)≤ V_CC(max), then reli-

able operation between V_CC(est)and V_CC(max)requires enhanced

P_D= V_IN

(1)

(2)

(3)

_θJA. If V_CC(est)≥ V_CC(max), then operation between V_CC(est)and

∆T = P_D

θJA

V_CC(max)is reliable under these conditions.

T_J= T_A+ ∆T

For example, given common conditions such as: T_A= 25°C,

V_CC= 12 V, I_CC= 4 mA, and R_θJA= 140 °C/W, then:

P_D= V_CC

= 12 V 4 mA = 48 mW

∆T = P_D

= 48 mW 140 °C/W = 7°C

θJA

T_J= T_A+ ∆T = 25°C + 7°C = 32°C

A worst-case estimate, P_D(max), represents the maximum allow-

able power level (V_CC(max), I_CC(max)), without exceeding T_J(max)

at a selected R_θJAand T_A.

Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036

A1101-DS

Worcester, Massachusetts 01615-0036 (508) 853-5000

www.allegromicro.com

1...6 7 8910 11

下载PDF

与A1104LUA-T相关器件

型号	品牌	描述	获取价格	数据表
A1104RW	MPD	Miniature, 10W DIP Single & Dual Output DC/DC Converters	获取价格
A1105RW	MPD	Miniature, 10W DIP Single & Dual Output DC/DC Converters	获取价格
A1106	ALLEGRO	Continuous-Time Switch Family	获取价格
A1106AG1	DBLECTRO	DIP PLUG PITCH 2.54mm	获取价格
A1106AG2	DBLECTRO	DIP PLUG PITCH 2.54mm	获取价格
A1106AS1	DBLECTRO	DIP PLUG PITCH 2.54mm	获取价格

与A1104LUA-T相关文章

STM32H743技术深度剖析与应用案例探索
2024-05-30

15
LM321中文资料解析：引脚功能介绍、技术特点、技术特性分析
2024-05-30

15
74HC14芯片资料介绍：性能特性分析、引脚介绍
2024-05-30

13
LM1875芯片手册：功放参数分析、引脚说明、电路设计要点
2024-05-30

10

产品中心

服务支持

精选活动

关于我们

帮助中心

A1104LUA-T

A1104LUA-T 技术参数

A1104LUA-T 数据手册

与A1104LUA-T相关器件

与A1104LUA-T相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

A1104LUA-T

A1104LUA-T 技术参数

A1104LUA-T 数据手册

与A1104LUA-T相关器件

与A1104LUA-T相关文章

您还可以找

您在本页遇到什么问题？