是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | SOP, | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.32 |
Is Samacsys: | N | 其他特性: | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS |
最大时钟频率 (fCLK): | 1 MHz | 数据保留时间-最小值: | 200 |
JESD-30 代码: | R-PDSO-G8 | JESD-609代码: | e3 |
长度: | 4.9 mm | 内存密度: | 4096 bit |
内存集成电路类型: | EEPROM | 内存宽度: | 8 |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 8 | 字数: | 512 words |
字数代码: | 512 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 512X8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 并行/串行: | SERIAL |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 1.75 mm | 串行总线类型: | MICROWIRE |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.8 V |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 3.9 mm |
最长写入周期时间 (tWC): | 6 ms | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
93LC66A-TI/SNG | MICROCHIP |
获取价格 |
512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 | |
93LC66AT-I/SNG | MICROCHIP |
获取价格 |
4K Microwire Compatible Serial EEPROM | |
93LC66AT-I/SNVAO | MICROCHIP |
获取价格 |
512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | |
93LC66ATI/ST | ETC |
获取价格 |
Microwire Serial EEPROM | |
93LC66A-TI/ST | MICROCHIP |
获取价格 |
512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-8 | |
93LC66AT-I/ST | MICROCHIP |
获取价格 |
4K Microwire Compatible Serial EEPROM | |
93LC66A-TI/STG | MICROCHIP |
获取价格 |
512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-8 | |
93LC66AT-I/STG | MICROCHIP |
获取价格 |
4K Microwire Compatible Serial EEPROM | |
93LC66ATIMS | MICROCHIP |
获取价格 |
4K Microwire Compatible Serial EEPROM | |
93LC66ATIMSG | MICROCHIP |
获取价格 |
4K Microwire Compatible Serial EEPROM |