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935311117518 PDF预览

935311117518

更新时间: 2023-03-15 00:00:00
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
169页 3169K
描述
Multifunction Peripheral

935311117518 数据手册

 浏览型号935311117518的Datasheet PDF文件第2页浏览型号935311117518的Datasheet PDF文件第3页浏览型号935311117518的Datasheet PDF文件第4页浏览型号935311117518的Datasheet PDF文件第5页浏览型号935311117518的Datasheet PDF文件第6页浏览型号935311117518的Datasheet PDF文件第7页 
Document Number: IMX6SDLCEC  
Rev. 9, 11/2018  
NXP Semiconductors  
Data Sheet: Technical Data  
MCIMX6SxExxxxxB MCIMX6SxDxxxxxB  
MCIMX6SxExxxxxC MCIMX6SxDxxxxxC  
MCIMX6SxExxxxxD MCIMX6SxDxxxxxD  
MCIMX6UxExxxxxB MCIMX6UxDxxxxxB  
MCIMX6UxExxxxxC MCIMX6UxDxxxxxC  
MCIMX6UxExxxxxD MCIMX6UxDxxxxxD  
i.MX 6Solo/6DualLite  
Applications Processors  
for Consumer Products  
Package Information  
Plastic Package  
BGA Case 2240 21 x 21 mm, 0.8 mm pitch  
Ordering Information  
See Table 1 on page 3  
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1  
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .3  
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5  
1.3 Updated Signal Naming Convention . . . . . . . . . . . .9  
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . .10  
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .10  
Modules List. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11  
3.1 Special Signal Considerations . . . . . . . . . . . . . . . .21  
3.2 Recommended Connections for Unused Analog  
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23  
1 Introduction  
The i.MX 6Solo/6DualLite processors represent the  
latest achievement in integrated multimedia-focused  
products offering high performance processing with  
lower cost, as well as optimization for low power  
consumption.  
2
3
4
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .23  
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . .23  
4.2 Power Supplies Requirements and Restrictions . .33  
4.3 Integrated LDO Voltage Regulator Parameters . . .34  
4.4 PLL’s Electrical Characteristics . . . . . . . . . . . . . . .36  
4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . .38  
4.6 I/O DC Parameters. . . . . . . . . . . . . . . . . . . . . . . . .39  
4.7 I/O AC Parameters. . . . . . . . . . . . . . . . . . . . . . . . .44  
4.8 Output Buffer Impedance Parameters . . . . . . . . . .49  
4.9 System Modules Timing. . . . . . . . . . . . . . . . . . . . .52  
4.10 General-Purpose Media Interface (GPMI) Timing .64  
4.11 External Peripheral Interface Parameters . . . . . . .72  
Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . .134  
5.1 Boot Mode Configuration Pins . . . . . . . . . . . . . . .134  
5.2 Boot Device Interface Allocation . . . . . . . . . . . . .135  
Package Information and Contact Assignments . . . . . .136  
6.1 Updated Signal Naming Convention . . . . . . . . . .136  
6.2 21x21 mm Package Information. . . . . . . . . . . . . .137  
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163  
The processors feature advanced implementation of  
®
®
single/dual Arm Cortex -A9 core, which operates at  
speeds of up to 1 GHz. They include 2D and 3D graphics  
processors, 1080p video processing, and integrated  
power management. Each processor provides a 32/64-bit  
DDR3/DDR3L/LPDDR2-800 memory interface and a  
number of other interfaces for connecting peripherals,  
®
such as WLAN, Bluetooth , GPS, hard drive, displays,  
and camera sensors.  
5
6
7
The i.MX 6Solo/6DualLite processors are specifically  
useful for applications such as:  
Web and multimedia tablets  
Web and multimedia tablets  
NXP Reserves the right to change the production detail specifications as may be  
required to permit improvements in the design of its products  

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