•
•
•
Branch prediction with return stack
Low-interrupt latency
Instruction and data memory management units (MMUs), managed using micro TLB structures
backed by a unified main TLB
•
•
•
•
•
•
Instruction and data L1 caches, including a non-blocking data cache with hit-under-miss
Virtually indexed/physically addressed L1 caches
64-bit interface to both L1 caches
Write buffer (bypassable)
™
High-speed Advanced Micro Bus Architecture (AMBA) L2 interface
Vector floating point co-processor (VFP) for 3D graphics and hardware acceleration of other
floating-point applications
™
•
ETM and JTAG-based debug support
Table 3 summarizes information about the i.MX35 core.
Table 3. i.MX35 Core
Core
Acronym
Core
Name
Integrated Memory
Features
Brief Description
ARM11 or
ARM1136
ARM1136 The ARM1136™ platform consists of the ARM1136JF-S core, the ETM
• 16-Kbyte
Platform
real-time debug modules, a 6 × 5 multi-layer AHB crossbar switch (MAX), and
instruction cache
• 16-Kbyte data
cache
• 128-Kbyte L2
cache
a vector floating processor (VFP).
The i.MX35 provides a high-performance ARM11 microprocessor core and
highly integrated system functions. The ARM Application Processor (AP) and
other subsystems address the needs of the personal, wireless, and portable
product market with integrated peripherals, advanced processor core, and
power management capabilities.
• 32-Kbyte ROM
• 128-Kbyte RAM
2.5
Module Inventory
Table 4 shows an alphabetical listing of the modules in the MCIMX35. For extended descriptions of the
modules, see the MCIMX35 reference manual.
Table 4. Digital and Analog Modules
Block
Mnemonic
Block Name
Domain1
Subsystem
Brief Description
1-WIRE 1-Wire
interface
ARM
ARM1136
platform
1-Wire provides the communication line to a 1-Kbit add-only
memory. the interface can send or receive 1 bit at a time.
peripherals
ASRC
Asynchronous SDMA
sample rate
converter
Connectivity
peripherals
The ASRC is designed to convert the sampling rate of a signal
associated to an input clock into a signal associated to a different
output clock. It supports a concurrent sample rate conversion of
about –120 dB THD+N. The sample rate conversion of each
channel is associated to a pair of incoming and outgoing sampling
rates.
i.MX35 Applications Processors for Automotive Products, Rev. 10
Freescale Semiconductor
7