The ball map for silicon revision 2.1 is different than the ballmap for silicon revision 2.0. The layout for
each revision is not compatible, so it is important that the correct ballmap be used to implement the layout.
See Section 5, “Package Information and Pinout.”
Table 2 shows the functional differences between the different parts in the i.MX35 family.
Table 2. Functional Differences in the i.MX35 Parts
Module
MCIMX351
MCIMX353
MCIMX355
MCIMX356
MCIMX357
I2C (3)
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
—
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
CSPI (2)
SSI/I2S (2)
ESAI
SPDIF I/O
USB HS Host
USB OTG
FlexCAN (2)
MLB
Ethernet
1-Wire
KPP
SDIO/MMC (2)
SDIO/Memory Stick
External Memory Controller (EMC)
JTAG
PATA
CE-ATA
—
Image Processing Unit (IPU) (inversion
and rotation, pre- and post-processing,
camera interface, blending, display
controller)
—
Open VG graphics acceleration (GPU)
—
Yes
—
Yes
Yes
i.MX35 Applications Processors for Automotive Products, Rev. 10
4
Freescale Semiconductor