Datasheet > 900764

900764

更新时间： 2022-02-26 11:45:54

品牌	Logo	应用领域
MACOM		/
页数	文件大小	规格书
21页	305K
描述
This specification covers the requirements for product performance

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900764 数据手册

Product Specification

108-5246

項目

試験項目

規

格

値

試

験

方

法

Para.

Test Items

Requirements

Procedures

3.5.18 Physical Shock

No electrical discontinuity Subject mated connectors to 50 G’s

greater than 1μsec. shall

occur.

half sine shock pulses of 16

millisecond duration, 3 shocks in

each direction applied along the

3 mutually perpendicular planes

to totally 18 shocks.

Termination resistance

(low level)(Final)

20 mΩ Max.

MIL-STD-202,METHOD 213

Condition A

The clamping manner shall be in

accordance with Fig.7 after

mating the connectors.

3.5.19 はんだ付け性

供試品を10倍の拡大鏡を用い

はんだ温度

：240 ± 5 °C

て目視検査し、ピンホールまたはんだ浸漬時間：3 ± 0.5 秒

は空隙が１つの面積に集中し

たり、全体の面積の5％を越え

ないこと。

使用フラックス：アルファー 100

(非活性ﾛｼﾞﾝﾍﾞｰｽ)

はんだ（Ｓｎ-3.0Ａｇ-0.5Ｃｕ）

はんだ濡れは95 % 以上。

3.5.19 Solderability

Appearance of the specimen

The soldering tine areas of the

shall be inspected after the contacts in post header assembly and

test with the assistance of a receptacle header assembly shall be

magnifier capable of giving a tested by immersing in flux.(Alpha

magnification of 10 X . More 100, non-active rosin base) for 3 to

than95% of the testedarea of 5 seconds first, then immerse into

the contact shall appear

sufficiently working fresh

coverage of wet solder,

withoutconcentrationofvoid

area in one place or whose

totalareaisnotgreaterthan

5% of the tested area.

soldering tub filled with melted

Sn-3.0Ag-0.5Cu controlled at 240 ±

5 °C for 3±0.5 seconds

Fig.2 （続き）

Fig.2(To be continued)

Rev. L

9 of 21

1...6 7 8910 11 12...21

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